Multi-Material Micro-Component Manufacturing via Powder Suspension

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Solution Overview

Problem

Current layer manufacturing methods, such as 3D printing, are limited in their ability to fabricate objects with true 3D structures and integrate multiple materials, particularly for microsystems packaging, which requires complex shapes and heterogeneous material combinations, leading to inefficiencies and high costs in production.

Innovation Solution

A method for additive layer manufacturing that uses a water-based powder suspension with particles below 5 μm to create thin layers, applies a binder, and selectively adds secondary materials through hydrophobic gaps, allowing for the integration of multiple materials and complex structures, including 3D vias and conductive lines, using techniques like slot die deposition and inkjet printing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If dry powder spreading is used to create powder layers, then deposition speed is high, but only coarser powders (10-20 μm) can be spread homogenously

Engineering Contradiction:
Improvedeposition speedVSAvoidlayer homogeneity
Core Design Contradiction:
SpeedVSManufacturing precision

Solution Approach 1:

The patent changes the physical state of the powder from dry to suspended in liquid, and changes the deposition method from spreading to spraying. This allows fine powders (below 10 μm) to be deposited homogenously while maintaining high deposition speed through spray techniques.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a liquid suspension medium (water or organic solvent) to carry the powder particles, and employs spray deposition using pneumatic or hydraulic means to achieve homogeneous distribution of fine powders that cannot be spread in dry state.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Adaptability or versatility

If multi-material integration is implemented, then functional complexity increases, but manufacturing process complexity increases

Engineering Contradiction:
Improvemulti-material integrationVSAvoidmanufacturing process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the manufacturing process into distinct stages: first depositing the main structure material, then creating cavities, and finally filling with secondary materials. This segmentation allows multi-material integration while managing process complexity through systematic sequencing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary actions by first creating the main structure and cavities before adding secondary materials. The cavities are formed in advance during the main structure deposition, preparing the structure for subsequent multi-material filling operations.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If true 3D structures are fabricated, then structural capability improves, but production time increases

Engineering Contradiction:
Improve3D structure capabilityVSAvoidproduction time
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges multiple manufacturing operations into a single additive process: structure deposition, cavity formation, and secondary material filling are all performed in one continuous manufacturing sequence, reducing production time compared to separate manufacturing and assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from traditional 2D layer-by-layer deposition to true 3D structure fabrication by incorporating cavity formation and internal feature creation during the deposition process, enabling complex 3D geometries without proportionally increasing production time.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the efficient production of objects with high precision and complex features, reducing production time and costs by allowing the integration of multiple materials and structures within a single manufacturing process, suitable for microsystems packaging and other high-precision applications.

Implementation Method 1

spreading a water-based powder suspension comprised of particles with a size below 5 μm in a layer with a thickness below 50 μm

Methodology Applied
Scientific EffectSuspension: Suspension

Implementation Method 2

applying a binder to the parts of the powder layer that should be retained in the shaped powder body

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 3

hydrophobizing selected parts of a flat substrate by applying a hydrophobic solution

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Implementation Method 4

applying one or more secondary materials as powder suspensions or powder pastes to the gaps in the layer

Methodology Applied
Scientific EffectSuspension: Suspension

Implementation Method 5

The binder is dried and the process is repeated

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 6

the object is then sintered. The boundaries between the original powder layers disappear and a solid object is created

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 7

The lose powder is rinsed or cleared from the object

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentUS9545669B2Layered manufacturing of free-form multi-material micro-components
Publication Date: 2017.01.17 DIGITAL METAL
  • US9545669B2 patent drawing
  • US9545669B2 patent drawing
  • US9545669B2 patent drawing

AI summary

The present invention relates to layer manufacturing, more particularly to a method for additive layer manufacturing of objects comprised of more than one material with free-form capability for all included materials. The invention can for example be used for producing packaging for Microsystems where the ceramic acts as an insulator and the secondary material is used to produce electrical or optical 3D conductor lines or electrical or optical 3D vias. The fine powder used in this method enables it to be used for building components with small feature size and demand for high precision. Other intended uses for this method is to build small mechanical precision parts or grinding tools, dental objects or medical implants.