Multimodal Sputter Trap Coating for Particle Retention Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sputter deposition processes face issues with particle formation during film deposition, which can disrupt the uniformity of the thin film and risk particles flaking off and affecting the deposited film.
Innovation Solution
A sputter trap with a multimodal particle size distribution is formed on the sputtering target assembly using a cold or thermal spray technique, adhering particles with a bimodal or multimodal particle size distribution to capture and retain particles, reducing the likelihood of flaking during cyclic thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sputter trap is used to capture particles during deposition, then particle capture capability is improved, but the risk of captured particles flaking off during cyclic thermal stress increases
Solution Approach 1:
The patent applies parameter changes by utilizing cyclic thermal stress during the sputtering process to gradually embed particles into the target surface. The repeated heating and cooling cycles cause particles to migrate and become firmly embedded in the target material, transforming them from loosely held captured particles to stably integrated particles that resist flaking during operation
Solution Approach 2:
The sputter trap is applied to the target surface before the deposition process begins. This preliminary application allows particles to be captured and then subsequently embedded into the target surface through the inherent cyclic thermal stress of the sputtering process, preventing flaking before it can occur during normal operation
2Manufacturing precision
If particles are captured on the sputtering target, then film uniformity is improved, but loosely held particles may flake off and disrupt the thin film
Solution Approach 1:
The patent utilizes parameter changes in the form of cyclic thermal stress to transform the state of captured particles from loosely held to firmly embedded. The repeated thermal cycles cause particles to migrate and become integrated into the target surface, eliminating the harmful flaking effect while maintaining the film uniformity benefit
3Object-affected harmful factors
If a sputter trap is applied to capture particles, then particle deposition on film is reduced, but particle retention during thermal stress becomes a concern
Solution Approach 1:
The patent applies parameter changes through cyclic thermal stress to improve particle retention. The thermal cycles cause particles to become embedded in the target surface, transforming them from a retained but potentially flaking state to a stably integrated state that maintains reliability under thermal stress conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sputter trap effectively captures and retains particles, minimizing their deposition on the film and reducing flaking, thereby enhancing film uniformity and stability during the PVD process.
Implementation Method 1
adhering particles to at least a portion the sputtering target assembly by a cold spray technique
Implementation Method 2
adhering particles to at least a portion the sputtering target assembly by a thermal spray technique
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
A sputter trap formed on at least a portion of a sputtering chamber component has a plurality of particles and a particle size distribution plot with at least two different distributions. A method of forming a sputter trap having a particle size distribution plot with at least two different distributions is also provided.