Multi-Mode Image Sensor Wiring Topology for Intra-Pixel Crosstalk

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Solution Overview

Problem

Existing pixelated image sensors face challenges in simultaneously supporting event-based vision sensor (EVS) mode and image-frame capture mode due to inter-circuit crosstalk, which affects image quality in both operating modes.

Innovation Solution

The implementation of a pixel design with two distinct sets of subpixels and corresponding electrical circuits, optimized metal interconnect structure to minimize spatial overlap between the circuits, reducing electromagnetic crosstalk and enhancing image quality in both modes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a pixelated image sensor supports both EVS mode and image-frame capture mode using shared circuits, then the device complexity is reduced, but inter-circuit crosstalk increases affecting image quality

Engineering Contradiction:
Improvecircuit structureVSAvoidinter-circuit crosstalk
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The pixel is divided into two distinct sets of subpixels, with each set having its own dedicated electrical circuit. This segmentation isolates the EVS circuit from the image-frame capture circuit, preventing inter-circuit crosstalk while maintaining support for both operating modes. The physical separation of circuits eliminates the harmful electromagnetic interference that would occur with shared circuits.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the metal interconnect structure has spatial overlap between wirings of two electrical circuits, then the wiring density is increased, but inter-circuit crosstalk increases

Engineering Contradiction:
Improvewiring densityVSAvoidelectromagnetic crosstalk
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The harmful spatial overlap between the two electrical circuit wirings is extracted and eliminated from the design. The metal interconnect structure is configured so that the wirings of the first electrical circuit and the second electrical circuit are spatially separated without overlap. This extraction of the overlapping region removes the source of electromagnetic crosstalk while still achieving efficient wiring through optimized routing paths.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces inter-mode interference, leading to improved image quality in both EVS and image-frame-capture modes by minimizing crosstalk and optimizing the metal interconnect structure within the pixel.

Implementation Method 1

An individual pixel of the sensor comprises two distinct sets of subpixels involved in the two modes, respectively... one or more first photodiodes and one or more second photodiodes

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

The metal interconnect structure of the image-sensor IC is implemented using a wiring topology in which spatial overlap between the wirings of the two electrical circuits is optimized (e.g., minimized) to reduce inter-circuit crosstalk

Methodology Applied
Scientific EffectElectromagnetic crosstalk reduction: Electromagnetic Induction

Data Source

PatentUS11929383B2Intra-pixel crosstalk reduction for a multi-mode image sensor
Publication Date: 2024.03.12 SONY SEMICON SOLUTIONS CORP
  • US11929383B2 patent drawing
  • US11929383B2 patent drawing
  • US11929383B2 patent drawing

AI summary

A pixelated image sensor capable of simultaneously supporting an EVS mode and an image-frame capture mode of operation. An individual pixel of the sensor comprises two distinct sets of subpixels involved in the two modes, respectively, and at least two corresponding, functionally different and independent electrical circuits. The metal interconnect structure of the image-sensor IC is implemented using a wiring topology in which spatial overlap between the wirings of the two electrical circuits is optimized (e.g., minimized) to reduce inter-circuit crosstalk when the two circuits are active at the same time. Such wiring topology may be beneficial, e.g., due to the resulting improvements in the image quality for both operating modes.