Multi-mode Thermal Imaging for Semiconductor Surface and Internal Analysis
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Solution Overview
Problem
The challenge in semiconductor manufacturing is accurately capturing thermal images of submicron fine patterns and internal temperature distributions of semiconductor devices, which affects their performance and reliability, as existing technologies are inadequate for high-resolution and sensitive thermal imaging.
Innovation Solution
A multi-mode thermal imaging device combining a microscope, spectroscope, and infrared thermal imager, operating in modes that utilize optical signals to derive reflectance change spectra and select optimal wavelengths for surface imaging, and infrared detection for internal temperature imaging, with adjustable bias signals and filters to achieve high-resolution and high-sensitivity thermal imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single thermal imaging method is used, then the device structure is simple, but it cannot achieve both high spatial resolution and sensitivity for different samples
Solution Approach 1:
The patent implements a multi-mode thermal imaging device that can operate in different modes (first mode and second mode) to handle different sample types. The device integrates multiple imaging capabilities into a single system, allowing it to adapt to various measurement requirements without requiring separate dedicated devices for each sample type.
Solution Approach 2:
The patent employs dynamic mode switching between different thermal imaging methods based on sample characteristics. The controller automatically selects the appropriate imaging mode (reflectance change imaging or infrared thermal radiation imaging) according to the sample properties, enabling the device to optimize performance for each specific measurement scenario.
2Measurement precision
If optical signal scanning is used for surface imaging, then spatial resolution is improved, but the ability to detect internal temperature distribution is reduced
Solution Approach 1:
The patent divides the thermal imaging detection into two distinct segments or modes: one for surface imaging using optical signal scanning with high spatial resolution, and another for internal temperature distribution detection using infrared thermal radiation. This segmentation allows each mode to be optimized for its specific purpose while both are integrated into a single comprehensive system.
3Adaptability or versatility
If multiple detection methods are integrated, then measurement versatility is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple thermal imaging detection methods (optical signal scanning and infrared thermal radiation detection) into a single integrated device. The system combines different detection principles and components while maintaining a unified structure controlled by a central controller, achieving measurement versatility without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate thermal imaging of both surface and internal temperature distributions with high spatial resolution, from micrometers to millimeters, improving the analysis of heat generation in semiconductor devices.
Implementation Method 1
a spectroscope; in a first mode among the multiple modes, the microscope scans a first sample with an optical signal from a light source, the spectroscope detects signals reflected from the first sample by separating them for each wavelength
Implementation Method 2
an infrared thermal imager; in a second mode among the multiple modes, the infrared thermal imager detects thermal radiation of a second sample to obtain a thermal image of the second sample
Data Source
AI summary
Disclosed are a multi-mode thermal imaging device and an operation method thereof. According to an embodiment of the present invention, in a first mode, a first sample is scanned with an optical signal from a light source, signals reflected from the first sample by the scanning are detected separately for each wavelength, a reflectance change spectrum according to the wavelength is derived on the basis of the signals detected separately for each wavelength, a wavelength is selected on the basis of the derived reflectance change spectrum, and a thermal image of the first sample is obtained, through a filter, by detecting an optical signal limited to the selected wavelength from among the signals reflected from the first sample. In a second mode, thermal radiation of a second sample is detected to obtain a thermal image of the second sample.