Multipart Cooling Module With Heat Pipes for Thin-TIM Rugged PCs
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Solution Overview
Problem
Conventional cooling solutions for rugged computers face challenges in efficiently transferring heat due to manufacturing tolerances, leading to increased thermal resistance and reduced thermal conduction, which is exacerbated by the need for thick Thermal Interface Material (TIM) between the chip and heatsink.
Innovation Solution
A multipart cooling module comprising a first frame in thermal contact with the chip, a second frame for heat dissipation, and heat pipes connecting the two, along with a stiffener to stabilize the printed circuit board, allowing for thinner TIM and improved thermal performance by compensating for manufacturing tolerances and enhancing heat transfer paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If monolithic aluminum heatsinks or mixed-metal heatsinks are used in conventional ANSI/VITA rugged conduction cooled compute modules, then manufacturing is simplified, but thermal resistance increases due to the need for thick Thermal Interface Material (TIM) to compensate for manufacturing tolerances
Solution Approach 1:
The cooling module is divided into multiple separate components: a first frame in thermal contact with the chip, a second frame for heat dissipation, and heat pipes connecting them. This segmentation allows each component to be manufactured independently with standard tolerances, eliminating the need for thick TIM to compensate for cumulative tolerances in monolithic structures.
Solution Approach 2:
Heat pipes are introduced as intermediary components between the first frame and second frame. These heat pipes provide a high thermal conductivity path that compensates for the air gaps and tolerances between discrete components, achieving better thermal contact than thick TIM could provide while maintaining manufacturing simplicity.
2Ease of operation
If thick Thermal Interface Material (TIM) is used between the chip and heatsink to accommodate manufacturing tolerances, then assembly is easier, but thermal resistance increases and thermal conduction decreases
Solution Approach 1:
The cooling system is segmented into discrete components (first frame, heat pipes, second frame) that can be assembled with standard tolerances. Each interface uses thin TIM layers rather than thick compensating layers, because the modular design with heat pipes provides the necessary tolerance compensation mechanically rather than relying on thick thermal material.
Solution Approach 2:
The thermal conductivity parameter is significantly improved by replacing the thermal path through thick TIM with a path through heat pipes, which have much higher thermal conductivity. This parameter change allows for thinner TIM while maintaining or improving overall thermal performance.
3Device complexity
If a single monolithic heatsink structure is used, then device complexity is reduced, but thermal performance deteriorates due to inefficient heat transfer paths
Solution Approach 1:
The cooling module is segmented into functionally distinct components: a first frame for heat collection from the chip, heat pipes for efficient heat transport, and a second frame for heat dissipation. This segmentation creates optimized heat transfer paths while keeping each individual component relatively simple to manufacture.
Solution Approach 2:
Instead of using a single monolithic structure that relies on thermal conduction through thick material, the invention inverts the approach by using discrete components connected by heat pipes, which actively transport heat rather than passively conducting it. This inversion of the thermal path strategy improves efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multipart cooling module achieves superior thermal performance by reducing thermal resistance, enabling efficient heat dissipation without forced convection, and maintaining operational reliability in harsh environments, including extreme temperatures and vibrations.
Implementation Method 1
The multipart cooling module further comprises heat pipes, thermally connecting the first frame and second frame to transfer the heat taken from the first frame to the second frame
Implementation Method 2
a first frame configured to take heat from the chip of a rugged computer by providing a mounting structure to mount the first frame in thermal contact with the chip
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A multipart cooling module (100) for cooling a chip (10) of a rugged computer is disclosed. The multipart cooling module (100) comprises: a first frame (no) configured to take heat from the chip (10) of a rugged computer by providing a mounting structure (115) to mount the first frame (110) in thermal contact with the chip (10); a second frame (120) configured to dissipate the heat taken from the first frame (110); and heat pipes (130), thermally connecting the first frame (110) and second frame (120) to transfer the heat taken from the first frame (110) to the second frame (120).