Multipart Mould Layer Assembly for Precision Deep-Cavity Tooling
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Solution Overview
Problem
Existing mould tools face challenges in achieving high precision finishes for small, thin, and light parts, particularly in fields like medical implants, consumer electronics, and optics, due to the impracticality of machining entire mould layers to high precision, and in forming high-depth parts with deep chambers, which are costly and difficult to manufacture.
Innovation Solution
A mould tool design comprising a carrier and an insert, where the insert is assembled to overlap temperature control zones, allowing for smaller, high-precision components to be manufactured at lower costs, and a mould face component with support elements for high Z-variation shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the entire mould layer is machined to high precision, then the mould surface finish quality is improved, but the machining cost and time increase significantly
Solution Approach 1:
The mould tool is divided into a carrier and an insert. The insert is the only component that requires high-precision machining to achieve the required mould surface finish quality. The carrier uses standard machining tolerances, significantly reducing overall machining costs and time while maintaining high precision where needed.
2Use of energy by moving object
If the mould layer is made thin and light to improve thermal agility, then the thermal response time is improved, but the structural rigidity decreases
Solution Approach 1:
The mould tool separates the carrier (providing structural support) from the insert (providing thermal interface). This allows the overall structure to maintain rigidity through the carrier while the insert can be thin for thermal agility.
Solution Approach 2:
The mould tool uses different materials for the carrier and insert, optimized for their respective functions. The carrier material prioritizes structural properties, while the insert material prioritizes thermal conductivity, creating a composite structure that balances rigidity and thermal response.
3Strength
If the mould layer is made thick to accommodate deep chambers, then the structural strength is improved, but the material waste and manufacturing cost increase
Solution Approach 1:
The mould tool separates the carrier (thick for structural strength) from the insert (thin for minimal material usage). The carrier provides the necessary structural strength to accommodate deep chambers, while the insert minimizes material waste by only containing the essential moulding cavity.
4Manufacturing precision
If the carrier is made to high precision tolerances, then the overall tool accuracy is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The mould tool separates the carrier from the insert, allowing only the insert to be manufactured to high precision tolerances. The carrier uses standard tolerances, significantly reducing manufacturing cost while the insert ensures tool accuracy through its precise machining.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective manufacturing of high-precision and high-depth parts by reusing the carrier with different inserts, reducing machining complexity and material waste.
Implementation Method 1
Thermal control assemblies and thermocouples extend from the utilities layer, through the exhaust layer and into the mould layer. The thermal control assemblies direct heating and cooling air at the temperature control face of the mould layer to heat or cool it.
Implementation Method 2
The thermocouples extend into contact with the temperature control surface. A controller can heat or cool each zone to match a desired temperature profile of the tool surface
Data Source
AI summary
A mould tool (100) is provided which has a multipart mould layer assembly (200; 300; 400; 500; 600) which may either be formed from a carrier (202; 302; 402; 502) and an insert (206; 306; 406; 506) defining a mould profile, or a mould face component (602; 702) having a plurality of stackable blocks (630, 632, 634) which can be assembled to form a mould layer.