Multipart Conductive Pillar IC Packaging for Miniaturization
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in accommodating high-speed devices, particularly in achieving precision, ultra-miniature form factors, and reliability while addressing cooling and cost concerns, with increasing complexity and potential errors in manufacturing.
Innovation Solution
The method involves using a multipart conductive pillar system comprising a pillar ball, an interposer with functional sides, and a pillar post formed through the interposer and encapsulation, which reduces the overall package size and enhances electrical connections while being resilient to stresses, and cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional single-part conductive structures are used, then manufacturing is simpler, but electrical connection reliability and stress resistance are insufficient for high-speed devices
Solution Approach 1:
The conductive pillar is divided into multiple parts: a pillar ball at the base, a pillar post extending upward, and conductive vias through the interposer. This segmentation allows each part to be optimized for its specific function - the ball provides a large bonding area, the post provides structural support, and the vias provide electrical connectivity through the interposer layer, thereby improving overall reliability while managing complexity through functional specialization.
Solution Approach 2:
The pillar post is positioned within and connected to the pillar ball, forming a nested structure where the post extends from the ball and continues through the interposer. This nested configuration ensures strong mechanical and electrical coupling between the base substrate and the upper circuit layers, enhancing connection reliability without requiring separate fastening mechanisms.
2Strength
If larger package structures are used to ensure reliability, then connection strength is improved, but package size increases contrary to ultra-miniature requirements
Solution Approach 1:
The pillar ball is designed with a larger diameter than the pillar post, concentrating the bonding area at the base where maximum strength is needed for mechanical attachment and electrical connection. The pillar post then tapers to a smaller size as it extends upward, providing sufficient structural support while minimizing the volume occupied in the upper regions where space is at a premium, thus achieving local optimization of strength-to-volume ratio.
3Manufacturing precision
If precision manufacturing processes are implemented to achieve ultra-miniature form factors, then packaging precision is improved, but manufacturing complexity and potential errors increase
Solution Approach 1:
The pillar ball and pillar post are pre-formed as integrated multipart structures before being positioned and connected to the interposer and substrate. This preliminary formation of the conductive pillar assembly allows for precise dimensional control and structural integrity to be established early in the manufacturing process, reducing the need for complex post-assembly adjustments and minimizing potential errors during final packaging operations.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a pillar ball; mounting an interposer having a first functional side and a second functional side over the pillar ball and a semiconductor chip; encapsulating the interposer, the pillar ball, and the semiconductor chip with an encapsulation; forming a via through the first functional side and the second functional side of the interposer, and through the encapsulation to expose a portion of the pillar ball; and filling the via with a pillar post.