Multipath Probe Design for Low Loop Inductance
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Solution Overview
Problem
The inductance of test probes can affect the frequency of test signals provided to and sensed from electronic devices under test, leading to inefficiencies in testing processes.
Innovation Solution
A multipath probe design with an electrically conductive signal path and an electrically insulated secondary path, where the gap between the paths is less than 50 microns, reducing loop inductance and allowing for efficient signal delivery and return paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional single-path probe design is used, then the structure is simple, but the loop inductance is high which limits testing frequency
Solution Approach 1:
The probe structure is segmented into multiple independent signal paths (primary and secondary paths) that operate in parallel. Each path is electrically insulated from the others but positioned closely together, allowing the system to achieve low equivalent inductance through parallel path configuration while maintaining manageable individual path complexity
Solution Approach 2:
The invention transitions from a single-dimensional signal path to a multi-dimensional configuration by introducing vertically stacked conductive plates (first and second conductive plates) with signal paths running between them. This three-dimensional arrangement allows closely spaced parallel paths without increasing horizontal footprint, effectively reducing loop area and inductance
2Object-affected harmful factors
If the gap between signal path and secondary path is reduced to less than 50 microns, then loop inductance decreases, but manufacturing precision requirements increase
Solution Approach 1:
The conductive plates are designed with extensive surface areas that are electrically conductive across their faces. This equipotential surface design reduces the sensitivity of the electric field distribution to small variations in gap distance, allowing the system to achieve low inductance with relaxed manufacturing tolerances compared to point-to-point connections
Solution Approach 2:
Multiple conductive elements are merged into large-area conductive plates where the entire plate surface functions as a single electrical terminal. This merging approach distributes the electrical connection across a broad area, making the inductance less sensitive to local gap variations and reducing the cumulative effect of manufacturing tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves low loop inductance, enabling testing at higher frequencies and improving the accuracy and efficiency of signal transmission in test probes.
Implementation Method 1
The signal path can be through one of the probes from its first contact end to its second contact end... An electrically conductive structure can electrically connect the first contact end and the second contact end
Implementation Method 2
The signal path can be electrically insulated from the signal path... An electrically insulating coating can cover at least part of the secondary contact
Data Source
AI summary
A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths.