Multiphase Buck Converter Package Modular Die Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multiphase buck converters are not modular, making it difficult for users to easily integrate them into existing circuits to adapt to dynamic load changes.
Innovation Solution
A multiphase buck converter package with at least four dice electrically connected through die attach pads, eliminating the need for wirebonding and allowing for easy addition to existing circuits, featuring a lead frame with parallel leads that can be easily connected in various configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonding techniques are used to connect dice, then electrical connection reliability is improved, but manufacturing complexity and time are increased
Solution Approach 1:
The patent extracts and eliminates the wirebonding step from the manufacturing process by directly integrating the dice onto the lead frame structure. The dice are mounted directly on the lead frame body, which provides both mechanical support and electrical connections, removing the intermediate wirebonding complexity while maintaining reliability.
Solution Approach 2:
The lead frame serves as an intermediary structure that combines both mechanical support and electrical connection functions. By designing the lead frame to directly contact and electrically connect the dice, the patent eliminates the need for separate wirebonding while maintaining reliable electrical connections.
2Device complexity
If multiphase buck converter is designed as non-modular unit, then system integration is simplified, but adaptability to existing circuits is reduced
Solution Approach 1:
The patent segments the multiphase buck converter into modular dice that can be independently mounted on the lead frame. This segmentation allows the converter to be easily integrated into existing circuits as a modular unit, improving adaptability while maintaining integration simplicity through the unified lead frame structure.
Solution Approach 2:
The lead frame is designed with universal mounting capabilities that allow the multiphase buck converter to be adapted to various existing circuit configurations. The standardized lead frame structure provides multi-functionality, serving as mechanical support, electrical connection, and mounting interface simultaneously.
3Power
If more dice are added to increase current handling capability, then power delivery is improved, but package area is increased
Solution Approach 1:
The patent utilizes the three-dimensional structure of the lead frame to mount dice in multiple layers and orientations. By transitioning from a two-dimensional to a three-dimensional arrangement, multiple dice can be accommodated within a compact package area, maintaining high current handling capability without proportionally increasing the package footprint.
Data Source
AI summary
Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dies and at least nine parallel leads. The dies are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.