Systems and methods for heat exchange
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Solution Overview
Problem
Current thermal management systems for electronic devices face challenges in efficiently regulating temperature, particularly in high-power systems like server rooms, where traditional cooling methods are costly and often implemented as secondary solutions after initial design, leading to inefficiencies and increased costs.
Innovation Solution
A multiphase thermal regulation system is introduced, comprising a closed loop fluid flow path with a first channel for liquid coolant, a second channel for vapor coolant, and a condenser for phase transition, along with a cooling interface that includes a coolant inlet, heat exchange unit, and outlet shut-off valve, allowing for controlled flow and phase change of the coolant to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional refrigeration systems are used to cool electronic systems, then the entire system or heat-generating components can be cooled, but the system cost increases and performance is reduced due to added complexity and secondary cooling architecture
Solution Approach 1:
The patent merges thermal management directly into the electronic system architecture by integrating heat exchange units with coolant channels directly onto the circuit board, eliminating the need for separate secondary cooling systems. This integration combines the thermal management function with the existing electronic system structure, reducing overall complexity while maintaining effective temperature regulation.
Solution Approach 2:
The patent implements thermal management during the initial system design and manufacturing phase rather than adding it later. By incorporating thermal management features into the original equipment manufacturer's design, the system proactively addresses heat issues before they become problems, avoiding the need for retrofitted cooling solutions.
2Temperature
If thermal management is added after manufacture of electronic systems, then existing systems can be cooled, but system costs increase and design efficiency decreases
Solution Approach 1:
The patent implements thermal management during the initial system design and manufacturing phase rather than adding it later. By incorporating thermal management features into the original equipment manufacturer's design, the system proactively addresses heat issues before they become problems, avoiding the need for retrofitted cooling solutions.
Solution Approach 2:
The patent merges thermal management directly into the electronic system architecture by integrating heat exchange units with coolant channels directly onto the circuit board, eliminating the need for separate secondary cooling systems. This integration combines the thermal management function with the existing electronic system structure, reducing overall complexity while maintaining effective temperature regulation.
3Loss of energy
If conventional cooling systems are used in high-power electronic systems, then heat can be removed, but system costs increase and efficiency decreases
Solution Approach 1:
The patent utilizes phase change materials or phase transition mechanisms in the heat exchange units to enhance heat dissipation efficiency. By leveraging the latent heat absorption during phase transitions, the system can remove large amounts of heat from high-power electronic components without requiring complex active cooling systems, thereby improving energy efficiency while reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides continuous, cost-effective thermal regulation, efficiently dissipating heat by leveraging phase changes, maintaining the temperature of heat sources within a desired range, and reducing system costs by integrating thermal management proactively.
Implementation Method 1
at least one heat exchange unit for permitting heat to flow from a source of thermal energy to the liquid coolant from the coolant inlet, thereby permitting the liquid coolant to undergo phase transition to the vapor coolant
Implementation Method 2
a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant
Implementation Method 3
at least one heat exchange unit for permitting heat to flow from a source of thermal energy to the liquid coolant
Data Source
AI summary
The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.