Multiphase DC/DC Converter PCB Layout for Compact High-Current Power

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Solution Overview

Problem

Conventional DC/DC converters occupy large areas due to the size of inductors and power modules, which limits their compactness and efficiency, especially in applications with high current requirements.

Innovation Solution

The power source device features N inductors and power modules mounted on both sides of a printed circuit board, with inductor chips connected in parallel to reduce their size and area, and power modules distributed on a sub-mounting surface to optimize layout and cooling performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If inductors and power modules are mounted on the same mounting surface, then the device structure is simple, but the occupied area is large

Engineering Contradiction:
Improveoccupied areaVSAvoidmounting structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent applies dimensionality change by mounting inductors on both the main mounting surface and the sub-mounting surface of the printed circuit board. This utilizes the third dimension (vertical stacking) to reduce the footprint area occupied by inductors while maintaining all necessary electrical connections through vias and conductive structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The mounting surface is segmented into a main mounting surface and a sub-mounting surface. Power modules are mounted on the main surface while inductors are distributed across both surfaces, dividing the component placement into distinct zones that optimize both area utilization and electrical performance.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If inductor chips are mounted on both main and sub-mounting surfaces, then the area is reduced, but the wiring complexity increases

Engineering Contradiction:
Improveoccupied areaVSAvoidwiring structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

Multiple inductor chips mounted on different surfaces are electrically connected in parallel by merging their terminals through conductive vias and traces. This combining approach reduces the overall inductance value while maintaining compact sizing, and the shared electrical connections simplify the wiring architecture despite the distributed physical layout.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11824429B2Multi-phase step-down DC/DC power source device
Publication Date: 2023.11.21 SONY INTERACTIVE ENTERTAINMENT LLC
  • US11824429B2 patent drawing
  • US11824429B2 patent drawing
  • US11824429B2 patent drawing

AI summary

A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.