Multiphase Power Stage Thermal Balancing With Per-Phase Temperature Readout

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Solution Overview

Problem

Existing temperature monitoring approaches in multiphase power stages are limited in accurately identifying the hottest and coldest phases, leading to inefficient thermal management and potential premature thermal shutdowns, especially in applications with multiple phases where a single temperature sensor's accuracy decreases with increasing phase count.

Innovation Solution

A communication bus system that assigns unique addresses to each phase, allowing for addressed communication between the controller and driver modules, enabling precise temperature monitoring and thermal balancing by transmitting temperature signals over a separate temperature bus, thereby identifying and managing the thermal performance of individual phases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single temperature sensor is used to monitor multiple phases, then device complexity is reduced, but measurement precision deteriorates as phase count increases

Engineering Contradiction:
Improvetemperature monitoring system complexityVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent divides the temperature monitoring system into separate monitoring channels for each phase. Each phase has its own temperature sensor and dedicated monitoring circuitry, allowing independent temperature measurement for each phase. This segmentation enables precise measurement of individual phase temperatures while maintaining manageable system complexity through modular architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The controller is designed with multi-functional capability to read temperature signals from multiple phases through a unified temperature monitoring circuit. The controller can selectively access temperature data from any phase by decoding phase identifiers from the temperature signals, enabling a single monitoring system to serve multiple phases without requiring separate dedicated circuits for each phase.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If per-phase temperature monitoring is implemented, then thermal management precision is improved, but device complexity increases

Engineering Contradiction:
Improvethermal management accuracyVSAvoidmonitoring system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple temperature sensors and their signal processing functions into a unified temperature monitoring circuit shared by all phases. The controller reads temperature signals from all phases through this single shared circuit by selectively activating different phases' temperature signals at different times, eliminating the need for separate monitoring circuits for each phase while maintaining per-phase measurement capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system implements periodic temperature reading cycles where the controller sequentially samples temperature signals from each phase in a repeating sequence. During each cycle, the controller activates temperature monitoring for one phase at a time, reads its temperature signal, then proceeds to the next phase. This periodic sampling approach enables per-phase temperature monitoring using shared resources, reducing overall system complexity while maintaining measurement precision.

Inventive Principle:
Principle #19Periodic action

Data Source

PatentUS12143019B2Monitoring temperature per phase in a multiphase power stage
Publication Date: 2024.11.12 SEMICON COMPONENTS IND LLC
  • US12143019B2 patent drawing
  • US12143019B2 patent drawing
  • US12143019B2 patent drawing

AI summary

A multiphase power stage that includes addressing and communication techniques to read temperatures of the phases for thermal load balancing is disclosed. The disclosure describes driver modules that can be assigned addresses for serial communication on a common communication bus by temporarily communicating the addresses over dedicated pulse width modulation connections between the driver modules and the controller. After assignment, a temperature request message, addressed to a driver module, can trigger the driver module to transmit an analog temperature signal to a common temperature bus coupled between the driver modules and the controller. The temperatures of the driver modules may be collected in order to activate and deactivate driver modules based on their temperatures, which can balance a thermal load on the multiphase power stage.