Multiphase Thermal Interface Component for Air Gap-Free Heat Transfer
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Solution Overview
Problem
Existing thermal interface materials struggle to effectively fill air gaps between thermal control devices and temperature-controlled components due to surface roughness and warpage, leading to high contact thermal resistance and potential overheating or damage to electronic devices during testing.
Innovation Solution
A multiphase thermal interface component combining a thermal interface solid element with accommodation spaces and a thermal interface fluid material in liquid, gas, or gel state, which fills air gaps and enhances thermal conduction by eliminating uneven thermal conduction caused by air gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a solid-state thermal interface material with textured surface is used to fill air gaps, then compressibility is improved, but larger height differences in textures create more air gaps
Solution Approach 1:
The patent applies a liquid-state thermal interface material that changes from liquid to solid state upon contact with the temperature-controlled component. This phase change allows the material to flow and fill all air gaps completely, then solidify to maintain contact, resolving the contradiction between compressibility and air gap formation
Solution Approach 2:
The thermal interface material undergoes a phase transition from liquid to solid when contacted by the temperature-controlled component. The liquid state enables complete filling of irregular surfaces and air gaps, while the solid state provides structural stability and maintains thermal contact, effectively eliminating the air gap problem
2Adaptability or versatility
If liquid-state thermal interface material is used to fill air gaps, then flowability is improved, but thermal conductivity becomes inferior and contamination risk increases
Solution Approach 1:
The patent uses a thermal interface material that transitions from liquid to solid state upon contact with the temperature-controlled component. The liquid state provides excellent flowability to fill air gaps, while the solid state delivers high thermal conductivity and prevents contamination, resolving the contradiction between flowability and reliability
Solution Approach 2:
The material undergoes phase transition from liquid to solid when contacted by the temperature-controlled component. The liquid phase enables complete gap filling through flowability, while the solid phase provides high thermal conductivity and contamination resistance, achieving both flowability and reliability
3Ease of operation
If surface textures with large height differences are designed to increase compressibility, then contact sufficiency is improved, but more air gaps are created
Solution Approach 1:
The patent employs a liquid-state thermal interface material that flows to fill all surface irregularities and air gaps, then solidifies to maintain contact. This eliminates the need for textured surfaces with large height differences, achieving complete contact without creating additional air gaps
Solution Approach 2:
The liquid-to-solid phase transition allows the material to adapt to any surface topology. In liquid state, it flows into all crevices and fills air gaps; after solidification, it maintains sufficient contact pressure, achieving contact sufficiency without requiring aggressive surface texturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multiphase thermal interface component achieves full surface temperature control, reducing contact thermal resistance and improving thermal conduction performance by ensuring complete contact between thermal control devices and electronic components.
Implementation Method 1
a thermal interface fluid material, which is filled into the at least one accommodation space of the at least one surface
Implementation Method 2
The thermal interface solid element has a first thermal conductive surface and a second thermal conductive surface... improving thermal conduction performance
Data Source
AI summary
A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.