Multiphase Thermal Interface Structure for Warpage-Induced Air Gaps
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Solution Overview
Problem
Air gaps between thermal control devices and temperature-controlled components due to surface roughness and warpage lead to high contact thermal resistance, affecting heat dissipation and potentially causing overheating or damage in electronic devices.
Innovation Solution
A multiphase thermal interface component combining a thermal interface solid element with accommodation spaces and a thermal interface fluid material that can be in liquid, gas, or gel state, filling air gaps to ensure complete surface contact and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid-state thermal interface material with textured surface is used to fill air gaps, then thermal contact is improved, but the material compressibility must be increased which may create larger air gaps
Solution Approach 1:
The patent changes the physical state parameter of the thermal interface material from solid to liquid, allowing it to flow and fill air gaps effectively without requiring compression that would create larger gaps. The liquid material adapts its shape to conform to surface irregularities while maintaining thermal contact.
Solution Approach 2:
The patent utilizes phase transition by employing a liquid-state thermal interface material instead of solid-state material. This phase change enables the material to flow into and fill air gaps, then remain in place through capillary action or adhesion, providing reliable thermal contact without the compression issues associated with solid materials.
2Reliability
If liquid-state thermal interface material is used to fill air gaps, then complete gap filling is achieved, but thermal conductivity is inferior and contamination risk increases
Solution Approach 1:
The patent employs composite material formulation by combining base liquid material with thermal conductive fillers (such as metal particles, ceramic particles, or carbon-based materials) suspended within the liquid matrix. This composite structure provides both the flowability needed to fill gaps completely and the high thermal conductivity required for effective heat transfer, while the viscous nature prevents contamination.
3Reliability
If surface roughness and warpage are present, then complete surface alignment is difficult achieving high contact thermal resistance, but increasing compression to improve contact may cause component deformation
Solution Approach 1:
The patent applies hydraulic principle by using a liquid-state thermal interface material that flows under its own viscosity and surface tension to fill irregularities and air gaps between surfaces. This fluid-based approach achieves complete gap filling and reliable thermal contact without requiring high compression forces that would deform components, as the liquid material adapts to surface geometry passively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multiphase thermal interface component effectively eliminates air gaps, improving thermal conduction performance and efficiency by ensuring full surface temperature control, thereby reducing the risk of overheating and enhancing heat dissipation.
Implementation Method 1
the capillary force is greater than the elastic recovery force of the resilient member, so that the thermal interface material can completely fill the accommodation space
Implementation Method 2
the surface tension of the thermal interface material is larger than the elastic recovery force of the resilient member
Implementation Method 3
A thermal interface material (TIM) is provided between a thermal control device and a temperature-controlled component so as to reduce the contact thermal resistance
Implementation Method 4
the phase change force generated when the phase change material changes from the liquid state to the solid state
Data Source
Figure 1A~1B
Figure 1C~2A
Figure 2B~2C
AI summary
A multiphase thermal interface component (T), a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component (T) includes a thermal interface solid element (2) and a thermal interface fluid material (3). The thermal conductive surface of the thermal interface solid element (2) has an accommodation space (S), and the thermal interface fluid material (3) is accommodated in the accommodation space (S). Therefore, the multiphase thermal interface component (T) combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material (3) can completely fill up the air gaps between the thermal interface solid element (2) and the thermal control device (Mt)/the temperature-controlled component (Oc), so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.