Multipixel Solid-State Sensor for SEM Inspection Accuracy
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Solution Overview
Problem
Current scanning electron microscopy (SEM) systems face challenges in efficiently and accurately inspecting semiconductor devices due to limitations in particle detection and processing, particularly as device sizes shrink, necessitating improved sensor technologies for enhanced inspection and review capabilities.
Innovation Solution
The development of a multipurpose sensor module for SEM systems incorporating a multipixel solid-state sensor connected to Application Specific Integrated Circuits (ASICs) for adaptive clustering and distributed digitization, enabling efficient conversion and processing of scattered particles into digital signals for defect detection and material composition analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional particle detectors are used in SEM systems, then the system structure remains simple, but the inspection accuracy and efficiency deteriorate due to limitations in detecting scattered particles
Solution Approach 1:
The sensor module is divided into multiple independent pixels, each capable of detecting scattered particles. This segmentation allows parallel processing of detection signals from different spatial locations, improving both inspection accuracy and enabling efficient signal processing through distributed architecture
Solution Approach 2:
The patent transitions from conventional single-point or simple array detectors to a two-dimensional multipixel solid-state sensor array. This dimensional expansion enables simultaneous detection across multiple spatial positions, significantly improving inspection accuracy while the integrated circuit processing handles the increased data complexity
2Manufacturing precision
If device size is reduced to improve semiconductor scaling, then manufacturing capability is enhanced, but inspection accuracy deteriorates due to smaller features being harder to detect
Solution Approach 1:
The multipixel sensor array provides fine spatial resolution by dividing the detection area into many small pixels. This segmentation enables precise localization of scattered particles originating from smaller semiconductor features, maintaining inspection accuracy even as device dimensions are reduced
Solution Approach 2:
The patent replaces conventional mechanical or simple electronic detection systems with solid-state photodetector pixels that convert scattered particle energy directly into electrical signals. This substitution enables highly sensitive detection of particles scattered from miniaturized features, preserving measurement precision at smaller scales
3Productivity
If multipixel solid-state sensors with ASIC processing are implemented, then inspection efficiency and accuracy improve, but the device complexity and processing requirements increase
Solution Approach 1:
The patent merges the sensing and processing functions into an integrated sensor module where multipixel solid-state detectors are directly connected to ASIC processing circuits. This merging enables real-time signal processing and defect identification, improving inspection efficiency while the integration reduces overall system complexity compared to separate sensing and processing systems
Solution Approach 2:
Each pixel in the sensor array is equipped with its own signal processing circuitry within the ASIC, enabling self-service processing of detection signals. This distributed processing architecture allows each pixel to independently convert and process its detected signals, improving overall inspection efficiency while reducing the burden on centralized processing systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy and efficiency of SEM systems by enabling real-time detection and analysis of defects and material composition, improving the inspection and review processes for semiconductor devices, particularly in smaller device sizes.
Implementation Method 1
a multipixel solid-state sensor configured to convert scattered particles from the sample into a set of equivalent signal charges
Implementation Method 2
an electron source configured to generate an electron beam
Data Source
AI summary
A scanning electron microscopy (SEM) system is disclosed. The SEM system includes an electron source configured to generate an electron beam and a set of electron optics configured to scan the electron beam across the sample and focus electrons scattered by the sample onto one or more imaging planes. The SEM system includes a first detector module positioned at the one or more imaging planes, wherein the first detector module includes a multipixel solid-state sensor configured to convert scattered particles, such as electrons and/or x-rays, from the sample into a set of equivalent signal charges. The multipixel solid-state sensor is connected to two or more Application Specific Integrated Circuits (ASICs) configured to process the set of signal charges from one or more pixels of the sensor.