Multi-Planar Solid State Amplifier for Compact RF Heat Dissipation
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Solution Overview
Problem
Solid state power amplifiers (SSPA) with traditional planar designs have a large footprint, making them unsuitable for compact applications such as mobile satellite communications systems, where space is limited and awkwardly shaped.
Innovation Solution
A solid state power amplifier design featuring multiple monolithic microwave integrated circuit (MMIC) modules arranged in multiple planes, connected via an RF waveguide split block and heat spreader, allowing for efficient heat dissipation and a non-traditional shape that can accommodate various size and shape requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If MMIC power amplifier modules are arranged in a single plane, then the amplifier structure is simple and heat dissipation is efficient, but the footprint area is large which is unsuitable for compact mobile applications
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional multi-planar configuration. MMIC power amplifier modules are arranged on multiple planes (front plane, back plane, and intermediate planes) around a central heat spreader, effectively utilizing the third dimension (depth/height) to reduce the footprint area while maintaining structural integrity and heat dissipation efficiency.
2Area of stationary object
If MMIC power amplifier modules are arranged in multiple planes, then the footprint area is reduced for compact applications, but the amplifier structure becomes more complex
Solution Approach 1:
The amplifier structure is segmented into multiple independent planes (front plane 10a, back plane 10b, intermediate planes 10c/10d) that can be separately designed, manufactured, and assembled. Each plane contains specific MMIC modules and connects to the central heat spreader, allowing modular construction that manages complexity through division while achieving compact multi-planar integration.
3Volume of moving object
If traditional planar design is used, then manufacturing is simple, but the amplifier occupies excessive space in mobile transport applications
Solution Approach 1:
The multi-planar MMIC modules are nested around the central heat spreader in a concentric arrangement. The front plane modules, back plane modules, and intermediate plane modules are positioned at different radial distances and angular positions, creating a compact nested structure that minimizes overall volume while maintaining manufacturing feasibility through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables reliable and efficient RF signal amplification while reducing the overall size and footprint of the amplifier, allowing it to be used in compact spaces like vehicles, aircraft, and ships.
Implementation Method 1
The heat spreader may be in thermal communication with the multiple MMIC power amplifier modules
Data Source
AI summary
A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.