Multi-Plane Assembly Board for Short-Circuit-Free Micro LED Placement
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Solution Overview
Problem
The existing methods for manufacturing display devices using semiconductor light emitting diodes face challenges such as low assembly rate and high risk of electrode short circuits during the self-assembly process, particularly when using electric and magnetic fields to position micro LEDs on assembly boards.
Innovation Solution
An assembly board design featuring electrodes of different polarities on separate planes, with a dielectric layer and barrier ribs, allows for precise positioning of semiconductor light emitting diodes using electric and magnetic fields, preventing short circuits and enhancing assembly efficiency by forming an electric field only at specific positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrodes are disposed on the same plane for self-assembly of semiconductor light emitting diodes, then the assembly process is simplified, but short circuit between electrodes occurs reducing assembly rate
Solution Approach 1:
The patent applies dimensionality change by transitioning electrode arrangement from a two-dimensional same-plane configuration to a three-dimensional multi-plane configuration. First electrodes and second electrodes are disposed on different planes (first plane and second plane respectively), separated by a dielectric layer, thereby preventing short circuits while maintaining effective electric field formation for self-assembly operations.
2Manufacturing precision
If electrodes of different polarities are disposed close to each other for efficient assembly, then assembly precision is improved, but risk of short circuit increases
Solution Approach 1:
The patent resolves the contradiction between positioning precision and short circuit prevention by utilizing the third dimension (vertical separation). Electrodes of different polarities are arranged on different planes with a dielectric layer in between, allowing them to be spatially close for effective electric field interaction while being vertically separated to prevent direct contact and short circuits.
Solution Approach 2:
The dielectric layer serves as an intermediary element between the first electrodes and second electrodes. This intermediary layer electrically isolates the electrodes of different polarities, preventing short circuits while allowing the electric field to penetrate through for effective positioning and assembly of semiconductor light emitting diodes.
3Adaptability or versatility
If assembly electrodes are added without limitation for selective assembly, then assembly flexibility is improved, but process complexity increases
Solution Approach 1:
The patent implements universality by creating a modular electrode structure where first electrodes and second electrodes on different planes can be independently configured and controlled. This multi-plane arrangement provides universal applicability for various assembly patterns and configurations, allowing flexible selective assembly while maintaining a systematic and manageable structure through the dielectric layer separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the assembly rate of semiconductor light emitting diodes by preventing electrode short circuits and enabling selective assembly, thereby increasing the yield and efficiency of the self-assembly process for large-screen display devices.
Implementation Method 1
allowing semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field
Implementation Method 2
allowing semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field
Data Source
AI summary
Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.