Optical System Multiplane Component Layout for EUV Lithography
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Solution Overview
Problem
The structural space restrictions and thermal management challenges in the use of MEMS mirrors in EUV lithography apparatuses, particularly due to the limited space behind the mirrors and heat generation, hinder efficient integration of electronic components.
Innovation Solution
The active and/or passive components are arranged in at least two different planes on the support apparatus, allowing for a high packing density and improved accessibility, with components on one side of the support apparatus and optical elements on the other, utilizing a substrate layer for structural efficiency and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If MEMS mirrors are used in EUV lithography apparatuses, then the ability to change light path alignment is improved, but structural space restrictions and heat dissipation difficulties worsen
Solution Approach 1:
The patent applies dimensional transition by arranging electronic components in multiple planes (first plane and second plane) behind the MEMS mirrors, transforming a two-dimensional space constraint into a three-dimensional solution. This allows components to be distributed vertically at different heights, effectively utilizing the available structural space and resolving the contradiction between adaptability and space limitations.
2Adaptability or versatility
If electronic components are integrated behind MEMS mirrors, then functionality is improved, but heat dissipation difficulty worsens
Solution Approach 1:
The patent distributes electronic components across multiple planes at different vertical positions behind the MEMS mirrors. This spatial distribution in three dimensions improves heat dissipation by increasing the surface area exposed to cooling mechanisms and reducing thermal concentration, while still maintaining functional integration.
3Quantity of substance
If components are arranged in multiple planes, then packing density is improved, but manufacturing complexity worsens
Solution Approach 1:
The patent segments the support structure into multiple distinct planes or levels, each capable of holding electronic components independently. This segmentation allows for modular assembly where components can be mounted on different planes separately, improving packing density while maintaining manufacturing feasibility through staged assembly processes.
Data Source
AI summary
An optical system for a lithography system comprises: a number of optical elements for guiding radiation; a support device supporting the optical elements; and a plurality of active and/or passive components. The active and/or passive components are arranged on the support device in at least two different planes. The active and/or passive components are arranged on one side of the support device.