Multiple-Component Substrate for Microelectronic Pinout Adaptation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional microelectronic device substrates often require a large area to accommodate all semiconductor die contacts, leading to increased package size and cost, particularly in space-sensitive applications where not all contacts are needed, and can result in suboptimal pinout configurations, complicating manufacturing and inventory management.
Innovation Solution
A multiple-component substrate assembly comprising a primary substrate and an auxiliary substrate, where the primary substrate redistributes some contacts to the bottom surface and others to the upper surface, allowing the auxiliary substrate to further redistribute contacts to desired locations, optimizing flexibility and reducing package height and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate redistributes all contacts of a semiconductor die, then complete electrical interconnection is achieved, but the substrate occupies a relatively large area relative to the semiconductor die
Solution Approach 1:
The substrate is divided into multiple components: a first substrate component that redistributes a first subset of contacts, and a second substrate component that redistributes a second subset of contacts. This segmentation allows each substrate component to be smaller in area while collectively handling all die contacts, resolving the contradiction between complete interconnection and substrate area.
2Reliability
If a larger substrate is used to provide external interconnect contacts for all die contacts, then complete contact redistribution is achieved, but the IC package size increases
Solution Approach 1:
The substrate system is segmented into multiple substrate components, each handling a portion of the contact redistribution function. This allows the overall package volume to be reduced compared to a single large substrate, while still achieving complete contact redistribution across all die contacts.
Solution Approach 2:
The patent utilizes vertical stacking of multiple substrate components in the Z-dimension, allowing contact redistribution to occur across multiple layers rather than requiring a single large planar substrate. This dimensional transition reduces the lateral footprint and overall package volume.
3Reliability
If multiple conductor levels are used to redistribute all die contacts, then complete contact redistribution is achieved, but the package height increases
Solution Approach 1:
The substrate system is segmented into multiple substrate components arranged in a stack, where each component handles a specific subset of contacts. This segmentation allows for more efficient routing of signal paths, reducing the need for multiple conductor levels within each substrate and thereby reducing overall package height.
4Adaptability or versatility
If multiple configurations of substrates are used to adapt to different pinout configurations, then application-specific optimization is achieved, but manufacturing and inventory overhead increases
Solution Approach 1:
The substrate system is segmented into multiple interchangeable substrate components that can be selectively combined. This segmentation enables a single base substrate to support multiple pinout configurations by attaching different auxiliary substrate components, achieving application-specific optimization without requiring entirely different substrate designs for each application.
Solution Approach 2:
The first substrate component is designed with universal functionality to handle a first subset of contacts, while the second substrate component provides configurable functionality for a second subset of contacts. This multi-functional design allows the same first substrate component to work with different second substrate components, reducing manufacturing and inventory overhead.
Data Source
AI summary
Microelectronic devices having a multiple-component substrate assembly. A primary supports one or more integrated circuits, and an auxiliary substrate is coupled to, and makes electrical connections with, the primary substrate. The primary substrate will define a pinout for some or all contacts of the integrated circuit, and the auxiliary substrate will provide an additional pinout option. Different configurations of a single primary substrate may be adapted to different applications through use of different configurations of auxiliary substrates.