Multiple-Die IC With Integrated Voltage Regulator
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power consumption in microprocessor systems leads to significant ohmic losses in power supply conductors due to low voltage used in CMOS processes, necessitating additional power supply pins and voltage regulators, which increase system cost.
Innovation Solution
Integration of multiple-die integrated circuits with integrated voltage regulator (IVR) dies using die-to-die bonding technologies like hybrid bonding, providing regulated voltages directly to processor dies, reducing IR losses and eliminating the need for external regulators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If more power supply pins and external voltage regulators are added to reduce IR losses, then power delivery efficiency is improved, but system cost increases
Solution Approach 1:
The patent combines the voltage regulator functionality with the processor die by integrating voltage regulator circuits directly into the processor package. This merging eliminates the need for separate external voltage regulator components and additional power supply pins, thereby reducing system cost while maintaining effective power delivery and minimizing IR losses.
2Use of energy by moving object
If low voltage is used in CMOS processes, then power consumption is reduced, but current increases creating large ohmic losses
Solution Approach 1:
The patent introduces an intermediate solution by integrating voltage regulator circuits directly into the processor package. This intermediary structure provides localized voltage regulation close to the power consumption sources, enabling efficient voltage delivery without requiring high currents through long external conductors, thus reducing ohmic losses while maintaining low-voltage CMOS operation.
3Power
If additional voltage regulators are placed externally, then power delivery capability is improved, but response time to load changes increases
Solution Approach 1:
The patent transitions from external to internal integration by placing voltage regulator circuits within the processor package itself. This dimensional change in integration level dramatically reduces the physical distance between power regulation and power consumption, enabling fast response times to load changes while maintaining high power delivery capability.
Data Source
AI summary
A data processor is implemented as an integrated circuit. The data processor includes a processor die. The processor die is connected to an integrated voltage regulator die using die-to-die bonding. The integrated voltage regulator die provides a regulated voltage to the processor die, and the processor die operates in response to the regulated voltage.