Multiple Die IC Assembly with Substrate Stacking

The patent combines multiple separate IC dies (RF section, baseband section, and memory die) into a single integrated circuit package. This merging of multiple functional dies reduces the overall PCB footprint while integrating diverse functions including radio frequency processing, baseband processing, and memory storage within one unified package structure.

The patent employs a nested arrangement where multiple dies are stacked or positioned within a single IC package substrate. The RF die, baseband die, and memory die are nested together on the same package substrate, with interconnections routed through the package structure, creating a compact nested configuration that minimizes external footprint.

The patent divides the integrated circuit into separate functional dies (RF section die, baseband section die, and memory die) that are manufactured independently using standard CMOS processes. This segmentation allows each die to be optimized and manufactured separately with established precision requirements, then integrated into the final package through controlled interconnection techniques.

The patent uses a package substrate as an intermediary structure that hosts multiple dies and provides the interconnection network. This intermediary substrate facilitates the integration of separately manufactured dies with different process requirements, allowing each die to be manufactured with appropriate precision for its function while achieving compact overall integration.