Multiple Die Redistribution Layer for Semiconductor Package
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Solution Overview
Problem
The existing semiconductor packaging technologies face challenges in efficiently transferring signal capabilities due to space constraints on substrates, requiring additional dummy 'jumper' dies and high-profile wire bonds, which are impractical for low-thickness packages.
Innovation Solution
A multiple die redistribution layer is formed across paired semiconductor dies before singulation, where bond pads from one die are relocated to another die, allowing for efficient pin-out connections along a substrate edge without the need for jumper dies, using a photolithographic process to layer and etch dielectric and metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If bond pads are relocated using a redistribution layer on a single die, then space on the substrate is saved, but the die thickness increases due to additional processing layers
Solution Approach 1:
The patent merges two adjacent dies into a single integrated structure with a shared redistribution layer that spans across the die interface. This consolidation allows bond pads to be redistributed to the edge of the combined structure without requiring separate redistribution layers on each individual die, thereby achieving space savings on the substrate while avoiding excessive thickness increase from multiple redistribution layers.
Solution Approach 2:
The patent extends the redistribution layer across the boundary between two adjacent dies, utilizing the lateral dimension to redistribute bond pads to the edge of the combined die structure. This approach transforms the problem from vertical stacking (increasing thickness) to lateral expansion (utilizing available planar space), effectively reducing substrate contact pad area requirements.
2Ease of operation
If jumper dies are used to relocate bond pads, then pin-out connections can be achieved, but device complexity increases due to additional dummy dies
Solution Approach 1:
The patent makes the second die serve multiple functions: it acts as both an active functional die and as a carrier for redistributed bond pads from the first die. This eliminates the need for separate jumper dies that would only serve as pad carriers, reducing the total number of dies while maintaining pin-out connection capabilities.
Solution Approach 2:
The second die performs self-service by hosting its own bond pads while simultaneously serving as the redistribution target for the first die's bond pads. This dual functionality allows the structure to eliminate dedicated jumper dies, reducing device complexity while maintaining the ability to achieve pin-out connections at the edge.
3Reliability
If high-profile wire bonds are used for bond pad redistribution, then electrical connections can be established, but package thickness increases
Solution Approach 1:
The patent performs bond pad redistribution at the wafer level before singulation, creating the electrical connection paths in advance through integrated circuit traces rather than requiring post-singulation wire bonds. This preliminary action eliminates the need for high-profile wire bonds, thereby reducing package thickness while maintaining electrical connection reliability through the planar trace structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient redistribution of bond pads, reducing package thickness and eliminating the need for jumper dies, thereby enhancing signal transfer capabilities while maintaining adequate pin-out positions on the substrate edge.
Implementation Method 1
using a photolithographic process to layer and etch dielectric and metal layers
Data Source
AI summary
A semiconductor device and methods of forming same are disclosed having multiple die redistribution layer. After fabrication of semiconductor die on a wafer and prior to singulation from the wafer, adjacent semiconductor die are paired together and a redistribution layer may be formed across the die pair. The redistribution layer may be used to redistribute at least a portion of the bond pads from the first die in the pair to a second die in the pair. One die in each pair will be a working die and the other die in each pair will be a dummy die. The function of the integrated circuit beneath the redistribution layer on the dummy die is at least partially sacrificed.