Multiple Ground Plane Thermal Sink for Superconducting Circuits
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Solution Overview
Problem
Monolithic Microwave Integrated Circuits (MMICs) face inefficiencies in heat removal at cryogenic temperatures due to superconducting solder bumps, leading to unacceptably high temperature gradients, as existing ground planes maintain all devices at the most stringent operating temperature, resulting in excessive cooling resource usage for components with lower temperature requirements.
Innovation Solution
The implementation of separate dedicated ground planes with varying thermal via sizes and numbers to match different operating temperature requirements, coupled to a thermal sink layer for efficient heat management, allowing each set of circuits to maintain its desired operating temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single ground plane is used to maintain thermal equilibrium, then temperature uniformity is improved, but cooling resource efficiency deteriorates due to over-cooling devices with lower temperature requirements
Solution Approach 1:
The ground plane is divided into multiple separate ground planes, each dedicated to specific devices with similar temperature requirements. This segmentation allows independent thermal management for each ground plane, enabling precise temperature control without over-cooling other devices.
Solution Approach 2:
Each ground plane is designed with specific thermal via characteristics (size, number, distribution) tailored to the local thermal requirements of the devices it serves. This local optimization ensures that each ground plane achieves its target temperature efficiency without being constrained by the requirements of other devices.
2Temperature
If thermal vias are increased to improve heat removal, then temperature control is improved, but device complexity increases due to varying via specifications
Solution Approach 1:
The thermal via structure is segmented into multiple ground plane-specific via sets. Each ground plane has its own dedicated thermal vias with optimized characteristics, allowing independent thermal management without requiring complex global via design.
Solution Approach 2:
The patent introduces variability in the vertical dimension by placing thermal vias at different depths and positions for different ground planes. This dimensional approach allows complex thermal management requirements to be satisfied through spatial differentiation rather than increasing via count uniformly across all layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables proportional thermal sink capacity based on circuit temperature requirements, reducing temperature gradients and optimizing cooling resources, thereby efficiently maintaining devices at their specific operating temperatures.
Implementation Method 1
separate dedicated ground planes... coupled to a thermal sink layer for efficient heat management... respective thermal vias (contacts)
Data Source
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AI summary
A superconducting system is provided that includes a coplanar superconducting circuit. The coplanar superconducting circuit includes a first ground plane region, a second ground plane region electrically isolated from the first ground plane region by portions of the coplanar superconducting circuit, and a tunable coupler having a first port and a second port. The tunable coupler comprises a variable inductance coupling element coupled between the first port and the second port, a first termination inductor having a first end coupled between a first end of the variable inductance element and a second end coupled to the first ground plane region, and a second termination inductor having a first end coupled between a second end of the variable inductance element and a second end coupled to the second ground plane region.