Multiple Heatsink Layout for Compact Line Voltage Thermostat Design

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Solution Overview

Problem

Traditional line voltage thermostats face integration constraints due to the bulky size of a single heatsink, limiting screen size and button placement options, as excessive heat from high electrical power damages switching components and restricts thermostat design aesthetics and functionality.

Innovation Solution

Implementing multiple heatsinks, each with a semiconductor switch, connected in parallel to distribute heat efficiently and allow for higher operating temperatures and thermal resistances, enabling a more compact and aesthetically pleasing design while maintaining or increasing power rating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single heatsink is used to cool the switching component, then the component is protected from excessive heat, but the thermostat becomes bulky and integration constraints limit screen size and button placement

Engineering Contradiction:
Improveheat dissipationVSAvoidthermostat size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The single heatsink is divided into multiple separate heatsinks, each associated with its own semiconductor switch. This segmentation allows the thermal management system to be distributed throughout the thermostat housing rather than concentrated in one location, reducing the overall envelope size while maintaining effective heat dissipation for each switching component.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If a single heatsink is used, then thermal management is simplified, but the layout flexibility for display and control buttons is severely limited

Engineering Contradiction:
Improvethermal management complexityVSAvoidlayout flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

By segmenting the thermal management system into multiple independent heatsink-switch assemblies, each unit can be positioned independently within the housing. This provides designers with flexibility to place the display and control buttons in optimal locations away from heat sources, while each heatsink independently manages the thermal load of its associated semiconductor switch.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each semiconductor switch and its associated heatsink form a localized thermal management unit with specific thermal characteristics optimized for that component's power dissipation requirements. This allows different parts of the thermostat to have different thermal properties, enabling flexible layout design where sensitive components like displays can be positioned in cooler zones.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If multiple heatsinks are used, then layout flexibility and screen positioning improve, but the device complexity increases

Engineering Contradiction:
Improvelayout flexibilityVSAvoidnumber of heatsinks
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by using multiple heatsinks, each paired with a semiconductor switch that handles a portion of the total power. This modular approach distributes the thermal management function across multiple simpler units rather than requiring one complex centralized heatsink system, making the overall design more manageable despite the increased number of components.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a smaller, more powerful, and aesthetically superior thermostat with improved integration of human-machine interface components, offering greater flexibility in design and functionality without compromising thermal performance.

Implementation Method 1

A heatsink may take up to two-thirds of a thermostat envelope and create many integration constraints

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Each of the two or more heatsinks... may have higher maximum operating temperatures and higher thermal resistances

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9683749B2Multiple heatsink cooling system for a line voltage thermostat
Publication Date: 2017.06.20 RESIDEO LLC
  • US9683749B2 patent drawing
  • US9683749B2 patent drawing
  • US9683749B2 patent drawing

AI summary

A line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat.