Multiple-Antenna Radio Unit PCB Structure for Heat Dissipation
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Solution Overview
Problem
Existing single-piece printed circuit boards (PCBs) in active antenna systems for wireless communication systems face issues with heat dissipation, electromagnetic interference, maintenance challenges, higher production costs, and lower yield rates due to the integration of antennas, RF components, and digital circuits, which limits system stability and lifespan.
Innovation Solution
A circuit structure utilizing multiple PCBs to distribute modules such as active antennas, RF components, and digital circuits, allowing for improved heat dissipation, reduced interference, and easier maintenance by separating components across different boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single multilayer PCB is used to integrate antennas, RF components, and digital circuits, then the system achieves high integration and compact size, but heat dissipation efficiency deteriorates due to limited heat dissipation area
Solution Approach 1:
The patent divides the integrated circuit system into multiple separate PCB boards, each dedicated to specific functions (antenna module PCB, RF component PCB, digital circuit PCB). This segmentation allows each board to have optimized heat dissipation designs tailored to its specific thermal characteristics, resolving the contradiction between integration and heat dissipation efficiency.
2Device complexity
If antennas, RF components, and digital circuits are closely integrated into a single PCB, then the system achieves compact size, but electromagnetic interference and electromagnetic compatibility issues worsen due to proximity of components
Solution Approach 1:
The patent segments the circuit system into multiple independent PCB boards with clear functional separation. Antenna modules, RF components, and digital circuits are placed on different boards, physically increasing the distance between potentially interfering components. This spatial separation effectively reduces electromagnetic interference while maintaining system integration through standardized inter-board connections.
3Device complexity
If a single multilayer PCB structure is used, then component integration is achieved, but manufacturing complexity increases resulting in higher production cost and lower yield rate
Solution Approach 1:
The patent divides the complex integrated system into multiple simpler PCB boards, each with fewer layers and less complex routing requirements. This segmentation simplifies the manufacturing process for each individual board, reducing production costs and improving yield rates. The modular design also allows for standardized manufacturing processes and easier quality control.
Solution Approach 2:
The patent employs standardized connection interfaces and modular designs that can be universally applied across different board configurations. This universality simplifies manufacturing by allowing the use of standard components, connectors, and assembly processes, thereby reducing production complexity and cost while maintaining the integrated functionality of the complete system.
4Device complexity
If all components are integrated into a single PCB, then the system achieves high integration, but maintenance and replacement become difficult as any aging or damage renders the entire system inoperative
Solution Approach 1:
The patent divides the system into multiple independent PCB boards, each containing specific functional modules. This segmentation enables independent maintenance and replacement of individual boards without affecting the entire system. If one board fails, only that specific board needs to be replaced or repaired, significantly improving ease of maintenance and extending system lifespan.
5Area of stationary object
If a single multilayer PCB is used, then the system achieves compact size, but the heat dissipation area is limited resulting in low heat dissipation efficiency
Solution Approach 1:
The patent transitions from a two-dimensional single-PCB layout to a three-dimensional multi-board stacked configuration. This dimensional change allows the system to utilize vertical space for heat dissipation, with each PCB board providing additional heat dissipation surfaces. The multi-board structure increases the total heat dissipation area without significantly increasing the horizontal footprint, thereby improving heat dissipation efficiency while maintaining compact overall size.
Data Source
AI summary
A circuit structure for multiple antenna radio units (RUs), base stations (BSs), and satellite communications is provided. Different from the current main technology using the circuit structure of a single printed circuit board (PCB), the circuit structure in this present disclosure consists of multiple PCBs, and the required modules of the active antenna such as the antennas and RF components; the digital circuit such as the fronthaul interface module, digital processing module of communications, beamforming module, and baseband digital circuit module; and the power module in the RU, BS, and satellite communications are allocated into the multiple PCBs. By elaborately allocating those modules into the multiple PCBs, they can coordinate for achieving the required functionality, and the overall performance can be optimized. The circuit structure can also be used in Massive MIMO (Multiple-Input Multiple-Output) BSs such that the corresponding transmit power can be reduced as a green technology.