Multiple Pixel LED Package Reduces Interconnect Complexity
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Solution Overview
Problem
Large LED displays face increased interconnect complexity and cost as the number of pixels grows, leading to manufacturing challenges and potential failure points.
Innovation Solution
The development of LED packages that integrate multiple pixels into a single package, using a common submount and lead frame structure to simplify electrical signaling and reduce material costs, while maintaining high resolution through reduced pitch between pixels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pixels in LED displays increases, then display resolution is improved, but interconnect complexity and cost increase
Solution Approach 1:
The patent combines multiple pixels (specifically 4 pixels) into a single integrated LED package, reducing the number of separate packages and interconnections needed. This merging approach maintains high display resolution while significantly reducing interconnect complexity and associated costs.
Solution Approach 2:
The integrated LED package serves multiple functions simultaneously - it contains multiple LED chips that can be independently controlled to form multiple pixels, while also providing a unified structural unit that simplifies mounting and interconnection. The single package structure acts as a universal building block for high-resolution displays.
2Measurement precision
If the number of pixels in LED displays increases, then display resolution is improved, but manufacturing complexity increases
Solution Approach 1:
By integrating multiple pixels into a single package during manufacturing, the patent reduces the number of assembly steps required. Instead of separately mounting and connecting multiple individual pixel packages, manufacturers can work with pre-integrated units, significantly simplifying the manufacturing process while achieving high display resolution.
3Measurement precision
If the number of pixels in LED displays increases, then display resolution is improved, but the number of potential failure points increases
Solution Approach 1:
The patent reduces the total number of discrete components and interconnections by integrating multiple pixels into unified packages. Since each interconnection point represents a potential failure point, reducing the number of connections through integration directly improves system reliability while maintaining high display resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the cost per pixel, simplifies manufacturing, and decreases the complexity of pixel interconnects, leading to more reliable and cost-effective large-scale LED displays with higher resolution.
Implementation Method 1
Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light.
Implementation Method 2
The reflective cup 13 may be filled with an encapsulant material 16 and a wavelength conversion material, such as a phosphor, can be included in over the LED chip or in the encapsulant. Light emitted by the LED at a first wavelength may be absorbed by the phosphor, which may responsively emit light at a second wavelength.
Data Source
AI summary
Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.