Multiple Technology Node Mask for Semiconductor Fabrication
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Solution Overview
Problem
The high cost and infrequent use of mask shuttles in semiconductor fabrication, which are shared among multiple customers and products, lead to prohibitively high costs for mask development and production, especially for sub-nodes, limiting their frequency of use.
Innovation Solution
A method of creating a multiple technology node mask (MTM) that combines patterns from different technology nodes on a single mask set, allowing for the use of either multiple technology node masks (MTMs) or single technology node masks (STMs) based on compatibility, with dummy patterns to prevent loading effects and separate mask data preparation for each node, enabling more frequent and cost-effective mask usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If mask shuttles are shared among multiple customers and products, then cost is reduced, but usage frequency decreases and becomes prohibitively high per use
Solution Approach 1:
The patent segments the mask shuttle service into multiple independent mask sets, each dedicated to specific technology nodes or customer requirements. This allows different mask sets to be used simultaneously for different purposes, increasing overall usage frequency while maintaining cost efficiency through shared infrastructure
Solution Approach 2:
The patent creates mask sets with universal applicability across multiple technology nodes by incorporating design rules and patterns that can be adapted to different node requirements. This multi-functionality increases utilization frequency without proportionally increasing fabrication costs
2Reliability
If multiple technology nodes are served by separate mask sets, then each node receives dedicated service, but mask fabrication costs and complexity increase
Solution Approach 1:
The patent merges multiple technology node requirements into unified mask sets where compatible nodes share the same mask infrastructure. This reduces the total number of mask sets required, lowering fabrication costs and complexity while maintaining dedicated service quality through proper segmentation of incompatible nodes
3Quantity of substance
If sub-node processes are processed less frequently, then mask fabrication costs are reduced, but sub-node development and production efficiency decrease
Solution Approach 1:
The patent implements dynamic mask set allocation where sub-node processing frequency is optimized based on demand, cost constraints, and compatibility with main-node processes. This allows sub-nodes to be processed more frequently when cost-effective, improving development and production efficiency without prohibitively increasing mask fabrication costs
Data Source
AI summary
A multiple technology node mask (MTM) is provided. An MTM includes a pattern associated with a first technology node and a pattern associated with a second technology node. The first technology node and the second technology node may be different. For example, the first technology node may be a main node and the second technology node a sub-node. A mask set including an MTM may also include single technology node masks (STMs) for mask layers in which the first technology node and second technology node and/or the patterns associated with each are not compatible. A single mask set including MTM and STMs, may be used to produce a plurality of devices, each on a different wafer.