Multiplexing Chip Lead for Medical Device

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Solution Overview

Problem

Existing active implantable medical device leads face challenges with the increasing number of electrodes and sensors, which lead to unacceptable dimensions and manufacturing difficulties due to the need for multiple conductors, and existing multiplexing solutions either restrict the internal lumen diameter or are difficult to implement reliably.

Innovation Solution

A lead design featuring a flexible sheath with a central lumen, a rigid cylindrical supporting tube encapsulating a multiplexing chip, and sector electrodes, allowing for a constant diameter and effective electrical insulation and mechanical protection, enabling standard implantation techniques and manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of electrodes and sensors is increased to enable multisite stimulation and hemodynamic monitoring, then the functionality and versatility of the device is improved, but the lead dimensions become unacceptable and manufacturing becomes difficult

Engineering Contradiction:
Improvedevice functionalityVSAvoidlead dimensions
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent merges multiple signal paths into a single shared lumen by integrating a multiplexing chip that handles multiple electrodes and sensors through common conductors, eliminating the need for separate conductors for each electrode and sensor

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The multiplexing chip provides multi-functionality by enabling a single conductor to carry multiple signals through time-division multiplexing, allowing the same physical infrastructure to support both pacing and sensing functions across multiple sites

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If multiplexing circuits are integrated into the lead to manage multiple signals, then the number of conductors is reduced, but the internal lumen diameter is restricted

Engineering Contradiction:
Improveconductor quantityVSAvoidinternal lumen diameter
Core Design Contradiction:
Device complexityVSLength of moving object

Solution Approach 1:

The patent transitions from spatial multiplexing (multiple parallel conductors) to temporal multiplexing (single conductor used at different times), adding the time dimension to signal transmission and eliminating the need for multiple simultaneous conductors

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The use of a flexible printed circuit board for the multiplexing chip allows for compact integration within the lead structure while maintaining flexibility and not compromising the internal lumen diameter

Inventive Principle:
Principle #30Flexible shells and thin films

3Ease of manufacture

If multiple conductors are used to connect each electrode and sensor, then the electrical connections are straightforward, but the manufacturing difficulty and lead dimensions become unacceptable

Engineering Contradiction:
Improveconnection simplicityVSAvoidconductor quantity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The multiplexing chip acts as an intermediary device that simplifies the connection architecture by providing a centralized interface between multiple electrodes/sensors and a single conductor, making the system easier to manufacture with fewer components

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11564605B2Method of manufacturing a lead for an active implantable medical device with a chip for electrode multiplexing
Publication Date: 2023.01.31 SORIN CRM
  • US11564605B2 patent drawing
  • US11564605B2 patent drawing
  • US11564605B2 patent drawing

AI summary

A method of manufacturing a lead. The method includes providing a supporting tube, and disposing a conductive strip on an outer surface of the supporting tube such that the conductive strip extends in an axial direction along a length of the supporting tube. The method also includes mounting a chip having a first conductive contact pad and a second conductive contact pad to the supporting tube such that the first conductive contact pad is in contact with the conductive strip. The method further includes fitting an electrode to the supporting tube such that the electrode is in contact with the second conductive contact pad, and coupling a conductor to each end of the supporting tube such that each conductor is in contact with the conductive strip. The method also includes covering at least one of the chip and the conductors with a sheath to provide the lead.