Dynamically Configurable Multi-Chip Package With Multiplexing Circuit
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Solution Overview
Problem
The complexity of memory device packaging configurations, which vary by die count and I/O channel count, complicates forecasting, manufacturing, and inventory management for memory vendors, requiring a wide variety of stock keeping units to service diverse end product applications.
Innovation Solution
A dynamically configurable multi-chip package design that allows the same set of dies to be configured for any number of channels using a multiplexing circuit, with the option to set the channel configuration using a fuse circuit or external signal, enabling flexible I/O port selection and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different package designs are used for different die counts and I/O channel counts, then correct routing of data signals is ensured, but the number of stock keeping units increases and manufacturing complexity increases
Solution Approach 1:
The patent implements a universal package design that can accommodate different die counts (SDP, DDP, QDP) and I/O channel configurations (single, dual, quad channel) using the same physical package structure. The multiplexing circuit enables a single package design to serve multiple functions by dynamically routing I/O ports to different dies based on the selected configuration, eliminating the need for multiple specialized package designs.
Solution Approach 2:
The patent introduces dynamic configurability through multiplexing circuits that can change the routing configuration based on external control signals. This allows the package to adapt its internal connections dynamically, switching between different die arrangements and channel configurations without requiring physical reconfiguration or different package designs for each scenario.
2Adaptability or versatility
If multiple package configurations are maintained for different end product requirements, then diverse end product applications are serviced, but forecasting and inventory management complexity increases
Solution Approach 1:
The universal package design allows memory vendors to stock a single type of package that can be configured for different end product requirements. By incorporating multiplexing circuits and flexible die arrangements, the same package can serve single-channel, dual-channel, and quad-channel applications, as well as different die counts, thereby reducing the variety of SKUs needed in inventory while maintaining broad adaptability.
3Device complexity
If dedicated I/O ports are allocated to each die, then simple routing is achieved, but the ability to support multiple channels is reduced
Solution Approach 1:
The patent employs dynamic multiplexing to allow I/O ports to be reassigned to different dies based on the operating configuration. Instead of dedicated static connections, the multiplexing circuit dynamically routes signals between I/O ports and dies, enabling the same physical ports to serve different functional roles depending on whether the system operates in single-channel, dual-channel, or quad-channel mode.
Solution Approach 2:
The multiplexing circuit acts as an intermediary between the I/O ports and the dies, managing the routing of signals dynamically. This intermediary layer allows flexible allocation of I/O resources without requiring direct dedicated connections between each I/O port and die, thereby supporting multiple channel configurations while maintaining routing manageability.
Data Source
AI summary
A semiconductor die includes one or more semiconductor devices (e.g., memory array, processors), first and second banks of I/O ports arranged along one or more sides of the die, and a multiplexing circuit. The multiplexing circuit can be changed between a first state and a second state. In the first state the first bank of I/O ports is coupled to the semiconductor device(s) and the second bank of I/O ports is not coupled to the semiconductor device(s), and in the second state the first bank of I/O ports is not coupled to the semiconductor device(s) and the second bank of I/O ports is coupled to the semiconductor device(s). The state of the multiplexing circuit can be set, for example, by an on-die fuse circuit or an externally accessible select line. The semiconductor die can be included in a chip package, which can be included on a printed circuit board.