Cockcroft Walton Multiplier Assembly for High-Voltage Power Supply
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Solution Overview
Problem
Conventional high-voltage power supplies using Cockroft Walton multipliers face issues such as excessive electric fields leading to ionization, power loss, flashover, and breakdown, and have mechanical instability due to loosely soldered components and uncontrolled attachment techniques, resulting in variations in performance and potential failure.
Innovation Solution
A compact high-voltage power supply with a multiplier assembly featuring a stack of capacitors and support elements electrically and mechanically coupled to form capacitor strings, using separable stage support elements to minimize surface conduction and electric field distribution, and a dielectric to stabilize the assembly, reducing size and power consumption while enhancing mechanical and electrical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional Cockroft Walton multiplier with loosely soldered components is used, then the power supply can generate high output voltage, but mechanical stability deteriorates and performance varies
Solution Approach 1:
The patent combines multiple functions into a single integrated circuit board structure. The circuit board simultaneously provides mechanical support, electrical connections, and component mounting for the Cockroft Walton multiplier stages, eliminating the need for loose soldering and hanging components. This integration ensures consistent component spacing and stable mechanical structure while maintaining high voltage generation capability.
Solution Approach 2:
The circuit board acts as an intermediary between the capacitor and diode components, providing a rigid substrate that maintains precise spacing and alignment. This intermediary structure prevents mechanical instability and performance variations by ensuring consistent geometric relationships between components throughout operation.
2Ease of manufacture
If multiplier components are loosely attached with uncontrolled spacing, then assembly is easier, but performance varies and failure occurs
Solution Approach 1:
The circuit board merges the functions of mechanical support, electrical connection, and spacing control into a single integrated structure. Components are mounted on the rigid circuit board with predetermined spacing, eliminating the need for complex alignment procedures while ensuring precise and consistent component positioning throughout manufacturing.
Solution Approach 2:
The circuit board design fixes the spacing parameter between components at specific values during manufacturing. This parameter control ensures that all assembled units have identical component spacing, eliminating performance variations while maintaining ease of assembly through standardized mounting procedures.
3Adaptability or versatility
If large housing is used for conventional multiplier, then components can be accommodated, but device size increases
Solution Approach 1:
The circuit board merges mechanical support, electrical connection, and spacing control functions into a compact integrated structure. This consolidation allows all multiplier components to be accommodated in a much smaller volume compared to conventional loose-attachment designs, reducing housing size while maintaining component functionality and adaptability.
Solution Approach 2:
The circuit board arrangement organizes components in a planar two-dimensional layout rather than requiring three-dimensional spacing with loose attachments. This dimensional reorganization allows efficient use of space, accommodating all necessary components in a compact footprint that significantly reduces housing volume.
4Power
If excessive electric fields are generated, then high output voltage is achieved, but ionization and flashover occur
Solution Approach 1:
The circuit board design incorporates equipotential grounding structures and carefully controlled electrical paths that distribute electric fields more uniformly. By creating equipotential regions and controlled potential gradients, the design achieves high output voltage while preventing excessive localized electric fields that would cause ionization and flashover.
Solution Approach 2:
The circuit board serves as an intermediary that controls and distributes electric fields between high-voltage nodes. The grounded substrate and controlled trace layouts act as field-management intermediaries, directing electric fields along safe paths and preventing uncontrolled field concentrations that lead to ionization and flashover events.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a significant reduction in size and power consumption while improving mechanical and electrical performance, preventing excessive electrical stress and enabling reproducible manufacture of a stable high-voltage power supply suitable for various applications.
Implementation Method 1
a dielectric to stabilize the assembly, reducing size and power consumption while enhancing mechanical and electrical robustness
Data Source
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AI summary
A multiplier assembly for a power supply and a method of manufacturing the multiplier assembly. The multiplier assembly may be a stack of capacitors and support elements electrically and mechanically coupled together to form a first capacitor string and a second capacitor string. The support elements may electrically and mechanically connect adjacent series capacitors in the first capacitor string. Additionally or alternatively, the support elements may electrically and mechanically connect adjacent series capacitors in the second capacitor string. In one embodiment, the power supply may include drive and feedback circuitry capable of controlling operation of the multiplier assembly.