Multi-Point Pressing Module for Chip-Level Force and Temperature Control
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Solution Overview
Problem
Conventional semiconductor packaging component testing equipment with a single pressing head and temperature controller is inadequate for advanced packaging technologies like 2.5D and 3D packaging, failing to uniformly contact and individually temperature-control multiple chips with varying thermal design power (TDP), leading to thermal crosstalk and reliability issues.
Innovation Solution
A pressing module with multiple pressing blocks, force-generating units, and temperature regulating units, controlled by a central unit, applies variable forces and temperature settings to each chip or region, ensuring uniform or distinct conditions for each chip, accommodating different TDPs and preventing thermal crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single pressing head and single temperature controller are used, then the device complexity is low, but the ability to contact and control multiple chips uniformly is insufficient
Solution Approach 1:
The single pressing head is segmented into multiple pressing blocks, each capable of independently contacting a specific chip. Similarly, the single temperature controller is segmented into multiple temperature controllers, with each controlling the temperature of a specific chip. This segmentation enables uniform contact and temperature control across multiple chips while managing complexity through modular design.
Solution Approach 2:
Each pressing block is designed with multi-functionality, serving both as a mechanical contact element for force application and as a mounting platform for temperature control. The pressing blocks integrate force-generating units and temperature regulating units, allowing a single component to perform multiple functions (mechanical pressing and thermal management) simultaneously.
2Manufacturing precision
If a single pressing head applies force to multiple chips, then the structure is simple, but uniform contact across all chips cannot be achieved
Solution Approach 1:
The pressing structure is divided into multiple independent pressing blocks, each responsible for contacting a specific chip. This segmentation allows each pressing block to be precisely positioned and adjusted to achieve uniform contact pressure across all chips, overcoming the limitation of a single pressing head that cannot adapt to variations in chip positions and heights.
Solution Approach 2:
Each pressing block is configured with local quality characteristics, including adjustable pressing forces and positions tailored to the specific requirements of each chip. The force-generating units can be independently adjusted to provide the optimal pressing force for each chip's characteristics, ensuring uniform contact quality across the entire semiconductor packaging component.
3Temperature
If a single temperature controller is used, then the system is simple, but individual temperature control of each chip is impossible
Solution Approach 1:
The temperature control system is segmented into multiple independent temperature controllers, with each controller dedicated to managing the temperature of a specific chip. This segmentation enables individualized temperature control for each chip, allowing different temperature settings for chips with varying thermal design power (TDP) requirements, and preventing thermal crosstalk between adjacent chips.
Solution Approach 2:
Each temperature controller provides localized temperature control tailored to the specific thermal characteristics of its associated chip. Chips with higher TDP can be maintained at optimal temperatures independently from chips with lower TDP, ensuring that each chip operates within its ideal thermal range without being affected by the thermal conditions of neighboring chips.
4Reliability
If chips with varying TDP are tested with uniform temperature control, then the temperature control system is simple, but thermal crosstalk issues occur
Solution Approach 1:
The temperature control system is divided into multiple independent control zones, each managed by a dedicated temperature controller. This segmentation allows chips with varying thermal design power (TDP) to be tested under their specific thermal requirements simultaneously, preventing thermal crosstalk while maintaining high testing reliability through individualized thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, uniform, or varied force and temperature application to each chip, enhancing testing accuracy and reliability by ensuring complete contact and optimal thermal management across semiconductor packages with advanced packaging technologies.
Implementation Method 1
the controller is adapted to control the temperature regulating units to respectively heat or cool the plurality of chips on the semiconductor packaging component
Implementation Method 2
the controller is adapted to control the force-generating units to drive the pressing blocks to respectively apply forces to the chips on the semiconductor packaging component
Data Source
AI summary
A pressing module capable of multi-point force application and multi-point temperature control and a semiconductor packaging component testing device having the same are provided. The pressing module is capable of simultaneously applying a plurality of forces, which may be the same or different, to a plurality of chips on a semiconductor packaging component, and simultaneously producing same or different temperature control effects on the chips. The device utilizes a plurality of force-generating units to drive a plurality of pressing blocks to respectively apply forces to the chips on the semiconductor packaging component, and utilizes respective temperature regulating units on the pressing blocks to respectively heat or cool the chips.