Multipolar Connector Ground Pattern Layout for 30+ GHz Signal Integrity
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Solution Overview
Problem
Multipolar connector sets experience characteristic deterioration in high-frequency bands due to capacitive coupling between connectors and substrates, particularly above 30 GHz.
Innovation Solution
The design incorporates a first and second connector with specific insulating members and internal/external terminals, along with substrates featuring ground conductor pattern non-formation regions facing external terminals, preventing capacitive coupling and maintaining ground absence at critical positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground conductor patterns are formed on both substrates for proper grounding, then grounding reliability is improved, but capacitive coupling occurs between connectors and ground causing characteristic deterioration in high-frequency bands
Solution Approach 1:
The patent applies local quality by creating a non-formation region specifically at the position on the second substrate that faces the first external terminal. This localized modification allows ground patterns to exist elsewhere for proper grounding while eliminating the harmful capacitive coupling only where it occurs, thus resolving the contradiction between grounding reliability and capacitive coupling prevention.
Solution Approach 2:
The patent extracts the ground conductor pattern from the specific region that causes capacitive coupling. By removing the ground pattern only from the non-formation region on the second substrate while maintaining it in other areas, the solution separates the harmful capacitive coupling effect from the necessary grounding function, resolving the technical contradiction.
2Ease of manufacture
If conventional multipolar connector sets are used with ground patterns on both substrates, then ease of manufacture is maintained, but characteristic deterioration occurs in high-frequency bands of 30 GHz or higher
Solution Approach 1:
The invention maintains ease of manufacture by applying a simple local modification - creating a non-formation region on the second substrate. This localized change to the ground pattern configuration requires minimal process modification while effectively suppressing capacitive coupling and improving high-frequency characteristics up to 43 GHz and above.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses characteristic deterioration in high-frequency bands up to 43 GHz, enhancing performance compared to existing technologies.
Implementation Method 1
a first external terminal <...> connected to ground potential
Implementation Method 2
a first insulating member <...> holding a plurality of first internal terminals
Data Source
AI summary
A multipolar connector set includes a first connector, a second connector including structure capable of being fitted to the first connector, a first substrate on which the first connector is mounted, a second substrate on which the second connector is mounted, a first ground conductor pattern formed on the first substrate, and a second ground conductor pattern formed on the second substrate. The first connector includes a first insulating member, first internal terminals held by the first insulating member and arranged in a first direction, and a first external terminal held by the first insulating member and connected to ground potential. The second substrate has a second conductor pattern non-formation region in which the second ground conductor pattern is not present at a position facing the first external terminal, when the first connector and the second connector are fitted to each other.