Multiscale CAE Model for Solder Joint Drop Shock Simulation
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Solution Overview
Problem
Current methods for simulating drop shock reliability of solder joints in consumer electronic products rely on simplified models, which fail to provide high-fidelity results and accurately capture nonlinear failure modes, making them inadequate for designing robust electronic devices.
Innovation Solution
A multiscale computer-aided engineering (CAE) model is employed, comprising a global CAE model for the electronic product and local CAE models for solder joints, simulated in different time scales with periodic synchronization based on kinematic and force constraints to evaluate the structural behavior and failure modes of solder joints during drop tests.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a simplified solder joint model and sub-modeling technique are used, then the simulation process is faster and easier to implement, but the fidelity of results and ability to capture nonlinear failure modes deteriorates
Solution Approach 1:
The patent divides the solder joint into multiple detailed sub-models (solder ball, metal pad, PCB, chip component) that can be independently simulated and then combined. This segmentation allows each component to be modeled with high fidelity while maintaining computational efficiency through modular analysis.
Solution Approach 2:
The patent implements a nested model structure where detailed solder joint models are embedded within the global CAE model. The local CAE model contains replicated solder joint models at multiple locations, creating a hierarchical structure that combines global and local analysis capabilities.
2Reliability
If physical drop tests are performed to evaluate solder joint reliability, then accurate reliability data is obtained, but the cost and time required increase significantly
Solution Approach 1:
The patent creates virtual copies of the physical drop test scenario through CAE simulation. The global CAE model replicates the drop test conditions and applies them to multiple solder joint locations simultaneously, providing reliability data without requiring actual physical testing.
Solution Approach 2:
The patent replaces physical mechanical drop tests with computational CAE simulation. The simulation uses finite element analysis and other computational methods to model impact forces and solder joint response, substituting physical testing with virtual analysis.
3Measurement precision
If a detailed multi-scale CAE model is used, then high-fidelity simulation of solder joint failure modes is achieved, but the computational complexity and resource requirements increase
Solution Approach 1:
The patent segments the complex solder joint system into distinct components (solder ball, metal pad, PCB, chip) with specialized models for each. This segmentation manages complexity by allowing focused modeling of critical areas while simplifying less critical regions.
Solution Approach 2:
The patent applies different levels of modeling detail to different regions of the solder joint based on their importance. Detailed models are applied to critical failure-prone areas while simpler models are used for less critical regions, optimizing the balance between accuracy and computational cost.
Data Source
AI summary
A global computer aided engineering (CAE) model representing an electronic product that contains solder joints and an individual detailed solder joint model are received. The solder joint model can include a solder ball, one or more metal pads, a portion of printed circuit board, and a portion of semiconductor chip component. The global CAE model includes locations of the solder joints to be evaluated in a drop test simulation. The solder joint model is replicated at each location to create a local CAE model via a geometric relationship between the global CAE model and the local CAE model. Simulated physical behaviors of the product under a design condition are obtained in a co-simulation using the global CAE model in a first time scale and the local CAE model in a second time scale. Simulated physical behaviors are periodically synchronized based on kinematic and force constraints.