Multisensor Assembly Enclosing MEMS Motion Sensor
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Solution Overview
Problem
MEMS devices require protective enclosures, leading to increased device size and a tradeoff between operational capability and space consumption, necessitating innovative solutions for compact multisensor assemblies.
Innovation Solution
A multisensor assembly is formed by combining multiple wafer members, each with different sensors, where at least one MEMS device is enclosed between layers to provide a compact and protective configuration, utilizing standard semiconductor materials or alternative materials like polymers and ceramics, and achieving a hermetic seal to protect internal workings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MEMS devices are provided with protective enclosures, then reliability is improved, but device volume increases
Solution Approach 1:
Multiple sensors are combined into a single integrated assembly where different sensor types (e.g., optical sensor, acoustic sensor, MEMS motion detector) are mounted on the same substrate and share common structural elements including the protective enclosure, thereby reducing total volume while maintaining individual sensor protection
Solution Approach 2:
Sensors are arranged in a nested configuration where smaller sensor components are positioned within or adjacent to larger sensor structures, allowing multiple sensing functions to coexist in a compact volume with shared protective housing
2Volume of moving object
If multiple sensors are integrated into a compact assembly, then device volume is reduced, but manufacturing complexity increases
Solution Approach 1:
The multisensor assembly is divided into modular functional blocks (different sensor types) that can be independently fabricated on separate wafer layers and then precisely aligned and bonded together, reducing overall manufacturing complexity through standardized modular interfaces
Solution Approach 2:
Multiple sensors are arranged in vertical layers stacked on top of each other along the z-axis rather than spreading them out in a planar configuration, achieving compact integration while using automated layer-by-layer fabrication and bonding processes
3Reliability
If wafer layers are joined to enclose MEMS devices, then protection from external damage is improved, but manufacturing precision requirements increase
Solution Approach 1:
Alignment features and bonding interfaces are pre-formed on wafer layers during separate fabrication processes before final assembly, allowing precise alignment to be achieved through mechanical interlocking and automated bonding equipment rather than requiring ultra-precise alignment during assembly
Solution Approach 2:
Adhesive bonding layers or intermediary bonding materials are used between wafer layers to accommodate minor misalignments and provide stress distribution, reducing the stringency of alignment precision requirements while still achieving hermetic sealing
Data Source
AI summary
One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.