Multi-Slot Card Edge Connector for High-Speed Signal and Power
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Solution Overview
Problem
Existing electrical connectors struggle to efficiently integrate high-speed signal transmission and high-power delivery in a compact, cost-effective, and backward-compatible configuration, particularly for devices like AI accelerators and networking modules.
Innovation Solution
A high-speed, high-bandwidth, and high-power card edge connector design with multiple slots and conductive elements, including first, second, and third conductive elements, each configured for specific functions, allowing for integrated signal and power transmission without additional components, and compatible with existing specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate electronic assemblies are joined with electrical connectors to enable data and power transmission, then connectivity and functionality are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines signal transmission and power delivery functions into a single card edge connector assembly. The connector integrates multiple conductive elements (signal contacts and power contacts) that simultaneously establish both signal and power connections when the circuit board is inserted, eliminating the need for separate connectors and reducing overall device complexity.
Solution Approach 2:
The card edge connector serves multiple functions: it provides mechanical support for the circuit board, establishes electrical signal connections through conductive elements in slots, delivers power through dedicated power contacts, and ensures proper positioning through features like the recessed region and protrusion-fitment interfaces. This multi-functionality reduces the number of separate components needed.
2Adaptability or versatility
If multiple separate connectors are used for signal and power transmission, then functional requirements are met, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent merges signal contacts and power contacts into a single integrated connector structure mounted on the circuit board. This consolidation allows both signal and power transmission functions to be achieved through one manufacturing process and single assembly operation, reducing manufacturing cost and simplifying production compared to using separate connectors.
3Volume of moving object
If a compact connector design is implemented, then space utilization is improved, but integration of high-speed signal and high-power delivery becomes more difficult
Solution Approach 1:
The patent utilizes the vertical dimension by recessing certain conductive elements and contact portions into the board thickness. The mating interface extends beyond the front surface while maintaining a compact overall profile. This dimensional arrangement allows multiple conductive elements to be positioned in three-dimensional space efficiently, achieving both compact size and proper integration of signal and power delivery paths.
4Adaptability or versatility
If existing connector specifications are maintained for backward compatibility, then compatibility is improved, but integration of high-speed and high-power functions becomes more challenging
Solution Approach 1:
The connector design maintains compatibility with existing card edge connector specifications while incorporating additional power delivery capabilities. The signal transmission portion follows established standards ensuring backward compatibility, while the integrated power contacts and conductive elements add high-power delivery function without requiring separate connectors or modifying existing mating interfaces.
Data Source
AI summary
High-speed, high bandwidth, and high-power card edge connectors. A connector can be configured to receive a circuit board's edge portion that has multiple insertion portions separated from each other by notches. The connector include multiple slots, each of which is configured to receive a respective insertion portion. A first slot provides access to power conductors. A second slot provides access to both power and signal conductors. The other slots provide access to signal conductors. The signal conductors can be configured to provide high-speed signal transmission (e.g., 112 GT/s with PAM4) or sideband signal transmission. The power conductors can be configured to provide high-power transmission (e.g., 200 W), enabling support for more power-hungry devices like AI accelerators, storage controllers, or networking modules.