Multi-Source Optical Interconnect Using MicroLEDs for Chip Data Links
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Solution Overview
Problem
Data transmission within and between large IC chips faces challenges of high power consumption and increased design complexity, especially in high-speed operations, and traditional laser systems struggle under high-temperature conditions typical of intra-chip and inter-chip connections.
Innovation Solution
Utilizing microLEDs and photodetector arrays for optical communication, coupled with optical couplers and transceivers, to establish efficient, compact, and cost-effective short-distance data links within and between IC chips, employing planar waveguides, multicore fibers, and free-space regions with lenses and mirrors for light manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional laser systems are used for optical communication, then long-distance fiber optic communication efficiency is improved, but power consumption increases and device complexity increases
Solution Approach 1:
The patent changes the fundamental parameters of the light source by transitioning from laser-based systems to microLED technology. This parameter change enables operation at lower power levels while maintaining communication effectiveness, directly resolving the contradiction between communication efficiency and power consumption
Solution Approach 2:
The patent employs microLEDs which are simpler, more robust, and consume less power compared to traditional laser systems. These microLEDs can be integrated directly onto chips, reducing both power consumption and system complexity while maintaining communication functionality
2Speed
If traditional laser systems are used for optical communication, then long-distance fiber optic communication is enabled, but device area increases
Solution Approach 1:
The patent changes the physical parameters of the light source system by adopting microLED technology with smaller form factors. This enables direct integration onto chip surfaces without requiring additional space, thereby reducing device area while maintaining communication efficiency
Solution Approach 2:
The patent integrates microLEDs directly onto chip surfaces, nesting the optical communication functionality within the existing chip footprint. This eliminates the need for separate laser modules and reduces overall device area
3Speed
If traditional laser systems are used for optical communication, then fiber optic communication is achieved, but reliability decreases under high-temperature conditions
Solution Approach 1:
The patent changes the operational parameters of the light source by selecting microLED technology which inherently operates reliably at high temperatures. This parameter change resolves the contradiction by maintaining both communication efficiency and reliability under high-temperature conditions typical of intra-chip and inter-chip connections
4Productivity
If multiple light sources are coupled to a single fiber, then bandwidth is increased, but device complexity increases
Solution Approach 1:
The patent segments the optical communication function into multiple independent microLED sources that can be individually controlled and coupled to a single fiber. This segmentation enables increased bandwidth through parallel data transmission while managing complexity through modular integration
Solution Approach 2:
The patent combines multiple microLED sources into a single integrated optical coupling system. This merging approach increases effective bandwidth by utilizing multiple light sources simultaneously while reducing overall device complexity through unified integration architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast, energy-efficient, and compact data exchange within and between IC chips, enhancing bandwidth and reducing power consumption through advanced optical interconnect systems.
Implementation Method 1
two microLEDs electrically coupled to the first integrated circuit chip and optically coupled to a single microfiber
Implementation Method 2
optical coupler configured to couple the plurality of light sources to a single fiber
Implementation Method 3
a photodetector array for receiving light
Implementation Method 4
a modulator for modulating transmission of data using at least one modulation scheme
Data Source
AI summary
A parallel interconnect system for transmitting data comprising: a plurality of light sources for emitting light for use as a carrier for the data; a first optical transceiver array having at least one optical transmitter; at least one fiber array configured to transmit light emitted by the at least one optical transmitter; an first optical coupler configured to couple the plurality of light sources to one end of the at least one fiber array; a second optical transceiver array having at least one optical receiver; a second optical coupler configured to receive and direct the transmitted light from another end of at least one fiber array to the second optical transceiver array.