Multispectral Imaging Device with Micromirror-Assisted Thermal Detection
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Solution Overview
Problem
CMOS image sensors are limited to detecting radiation in the visible or near infrared spectral range, as silicon-based photosensitive materials are not sensitive to longwave infrared radiation, preventing direct thermal imaging.
Innovation Solution
An imaging device with a detector array of subpixels of varying spectral sensitivities, combined with a micromirror array and an internal light source, allows simultaneous capture of visible and thermal images using a single detector array, enabling multi-spectral imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single silicon-based detector array is used, then the device structure is simplified and cost is reduced, but the spectral detection range is limited to visible and near infrared only
Solution Approach 1:
The patent introduces an internal light source as an intermediary that enables the silicon-based detector array to indirectly detect longwave infrared radiation. The light source converts longwave infrared radiation from the scene into visible or near infrared light that the silicon detector can detect, thus extending the spectral range without requiring additional specialized detectors
Solution Approach 2:
The patent changes the operational parameters of the detector array by using multiple subpixel types with different spectral sensitivities (e.g., red, green, blue, and near infrared sensitive subpixels). By selectively activating different subpixel types based on the radiation type being detected, the system achieves multi-spectral imaging capability with a single detector array
2Adaptability or versatility
If separate cameras are used for visible and thermal imaging, then the spectral detection capability is improved, but the system size, cost, and power consumption increase
Solution Approach 1:
The patent merges the functions of separate visible and thermal imaging cameras into a single integrated device. By combining the internal light source, micromirror array, and multi-subpixel detector array into one system, the patent achieves both visible and thermal imaging capabilities while reducing the number of separate camera modules needed
Solution Approach 2:
The single detector array is designed with universal functionality to detect both visible light and longwave infrared radiation through different operating modes. The micromirror array serves dual purposes by directing both visible light and infrared radiation to appropriate detector regions, making the system highly versatile
3Adaptability or versatility
If multiple separate imaging systems are integrated, then the multi-spectral imaging capability is improved, but the alignment accuracy and readout complexity worsen
Solution Approach 1:
The patent merges the imaging functions into a single detector array with multiple subpixel types, eliminating the need for complex alignment between separate camera systems. The shared detector substrate and unified readout electronics inherently ensure precise spatial alignment between visible and thermal images
Solution Approach 2:
The detector array is segmented into multiple subpixel types with different spectral sensitivities within each pixel location. This segmentation allows simultaneous detection of different spectral bands at the same spatial location, ensuring perfect pixel-to-pixel alignment between different spectral images
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces system cost, size, and power consumption while ensuring accurate overlap and simplified readout of visible and thermal images, eliminating the need for separate cameras and software processing.
Implementation Method 1
the mirror elements are configured to deflect in response to longwave infrared radiation
Implementation Method 2
the internal light source is configured to emit radiation that is detectable by the detector array
Implementation Method 3
CMOS image sensors are widely used for detection of radiation in the visible or near infrared spectral range
Data Source
AI summary
An imaging device is specified, the imaging device including a detector array a plurality of pixels, the pixels including a plurality of subpixel types, a micromirror array with a plurality of mirror elements, and an internal light source, wherein at least one of the subpixel types is configured to detect a first radiation; the mirror elements are configured to deflect in response to a second radiation, the internal light source is configured to illuminate the detector array with a third radiation; at least one of the subpixel types is configured to detect the third radiation deflected by the micromirror array. Furthermore, a method of multi-spectral imaging is specified.