Inductively Coupled Multi-Stack Amplifier for Harmonic Suppression

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Solution Overview

Problem

RF circuitry, particularly power amplifiers, face challenges with harmonic distortions and reduced efficiency due to reactive components at intermediate nodes in transistor stacks, especially at millimeter-wave frequencies, affecting performance metrics like ACLR and EVM.

Innovation Solution

A multi-stack amplifier with inductive coupling between transistors in the stack to compensate for reactive components, using shunt inductors at intermediate nodes to resonate and trap harmonic distortions, and a reconfigurable transistor stack architecture with switches to dynamically adjust the number of active transistors based on operational state.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If transistor stacks are used to amplify RF signals, then power output is increased, but reactive components at intermediate nodes cause harmonic distortions and reduce efficiency

Engineering Contradiction:
Improvepower outputVSAvoidefficiency
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

Inductive elements are introduced as intermediary components at the intermediate nodes between transistors in the stack. These inductors compensate for the reactive components (capacitances) generated by the transistor gates and interconnects, creating a more balanced impedance environment that reduces harmonic distortions and improves power-added efficiency while maintaining high power output capability

Inventive Principle:
Principle #24Intermediary (Mediator)

2Power

If transistor stacks are used to amplify RF signals, then power output is increased, but harmonic distortions increase affecting ACLR and EVM

Engineering Contradiction:
Improvepower outputVSAvoidharmonic distortions
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

Inductive elements serve as mediator components that counterbalance the capacitive reactive effects at intermediate nodes. By providing inductive reactance that compensates for capacitive reactance, these elements reduce the formation of harmonic distortions, thereby improving spectral purity metrics like ACLR and EVM while preserving the high power output benefit of stacked transistor architecture

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If fixed transistor stack configuration is used, then device complexity is reduced, but adaptability to varying supply voltages and output powers is limited

Engineering Contradiction:
Improvedevice complexityVSAvoidadaptability
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamic reconfigurability by introducing control circuits and switching mechanisms that allow the transistor stack configuration to be dynamically adjusted. This enables the amplifier to adapt its number of active transistors, supply voltage, and output power levels based on operational requirements, transforming a static fixed configuration into a dynamic adaptable system without excessive complexity increase

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves amplifier performance by reducing ACLR and EVM and increasing power-added efficiency (PAE) through impedance matching and harmonic distortion suppression, enabling efficient operation across varying supply voltages and output powers.

Implementation Method 1

the first inductive element is arranged to be inductively coupled to the second inductive element

Methodology Applied
Scientific EffectInductive coupling: Electromagnetic Induction

Implementation Method 2

using shunt inductors at intermediate nodes to resonate and trap harmonic distortions

Methodology Applied
Scientific EffectResonance: Resonance

Implementation Method 3

Improves amplifier performance by reducing ACLR and EVM and increasing power-added efficiency (PAE) through impedance matching and harmonic distortion suppression

Methodology Applied
Scientific EffectImpedance matching:

Data Source

PatentUS20250385649A1Inductively coupled multi-stack amplifier
Publication Date: 2025.12.18 QUALCOMM INC
  • US20250385649A1 patent drawing
  • US20250385649A1 patent drawing
  • US20250385649A1 patent drawing

AI summary

Certain aspects of the present disclosure provide an inductively coupled multi-stack amplifier. An example amplifier includes a first transistor stack comprising a first input node, a first transistor, and a second transistor. The amplifier further includes a second transistor stack comprising a second input node, a third transistor, and a fourth transistor, wherein the first input node and the second input node form an input pair for a differential input signal. The amplifier further includes a first inductive element having a first terminal coupled between the first transistor and the second transistor. The amplifier further includes a second inductive element having a second terminal coupled to a drain of the second transistor, wherein the first inductive element is arranged to be inductively coupled to the second inductive element.