Multi-Stack Semiconductor Package for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in effectively managing heat dissipation and temperature rise, particularly in high-power applications, which can lead to performance degradation and reliability issues.
Innovation Solution
The semiconductor device incorporates a novel structure with multiple stacks and conductors that form heat radiation paths to dissipate heat from semiconductor elements and terminals, using copper-based conductors and insulating materials to suppress temperature rise and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power semiconductor elements are integrated in a single package, then output power is increased, but heat dissipation becomes more difficult and temperature rise increases
Solution Approach 1:
The semiconductor device is divided into multiple independent stacks (first stack with semiconductor element, second stack without semiconductor element) that are separately mounted on the base substrate. This segmentation allows heat from the active semiconductor element to be isolated and managed independently, preventing heat accumulation in a single concentrated area while maintaining high power output capability.
Solution Approach 2:
A heat radiation path is introduced as an intermediary thermal management component between the semiconductor element and the environment. This heat radiation path includes thermal conduction paths through the stack structure and thermal radiation surfaces, acting as a mediator to efficiently transfer and dissipate heat away from the semiconductor element, thereby controlling temperature rise while maintaining high power operation.
2Productivity
If multiple semiconductor elements are integrated in one package, then productivity and power output are improved, but heat management complexity increases
Solution Approach 1:
The package is segmented into multiple stacks with distinct functions - the first stack contains the semiconductor element for power generation, while the second stack serves as a dedicated heat radiation structure. This functional segmentation simplifies heat management by separating heat-generating components from heat-dissipating components, reducing the complexity of thermal management while maintaining high integration efficiency.
Solution Approach 2:
The base substrate serves multiple functions simultaneously: it provides mechanical support for mounting stacks, acts as a common platform for electrical connections, and functions as part of the heat radiation path. This multi-functionality reduces the number of separate components needed, simplifying the overall heat management system while maintaining high productivity through effective integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively suppresses temperature rise in semiconductor elements and terminals, improving device reliability and performance by enhancing heat dissipation without compromising structural integrity.
Implementation Method 1
The semiconductor device incorporates a novel structure with multiple stacks and conductors that form heat radiation paths to dissipate heat from semiconductor elements and terminals, using copper-based conductors and insulating materials to suppress temperature rise
Data Source
AI summary
According to one embodiment, a semiconductor device includes a base substrate; a case provided on the base substrate; a first stack provided inside the case on the base substrate; a second stack provided apart from the first stack on the base substrate; and a first conductor having a flat plate shape and including a first portion in contact with the first stack and a second portion in contact with the second stack. The first stack includes a first insulator, a second conductor provided on the first insulator and in contact with the first portion, and a first semiconductor element electrically connected to the second conductor. The second stack includes a second insulator and a third conductor provided on the second insulator and in contact with the second portion, and does not include a semiconductor element.