Multi-Stage Die Bonding for Precise Donor-Target Alignment
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Solution Overview
Problem
In the manufacturing of integrated circuits, achieving accurate and fast placement of die with varying fabrication layers and critical dimensions is challenging, particularly in heterogeneous integration, where precise alignment of conductive contact elements is required for functional connectivity.
Innovation Solution
A system comprising a first stage to support donor dies, a second stage to support target dies, a measurement system to measure their positions, and a positioner system to provide relative movement for alignment, enabling precise die bonding through multi-stage positioning and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multi-stage positioning and alignment is implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The positioning system is divided into multiple independent stages, each responsible for a specific positioning task. The first stage positions the donor substrate, the second stage positions the target substrate, and the third stage performs final alignment. This segmentation allows each stage to be optimized independently while achieving cumulative positioning precision.
Solution Approach 2:
A measurement system acts as an intermediary between the positioning stages and the control system. It measures the actual positions of donor and target dies, providing feedback data that enables the positioner system to calculate and execute precise alignment corrections.
2Manufacturing precision
If measurement and alignment procedures are extended, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The system performs preliminary positioning of donor and target substrates on separate stages before final alignment. This allows rough positioning to be completed quickly, with only fine adjustments requiring precise measurement and alignment, thereby reducing the time-critical path of the process.
Solution Approach 2:
The measurement and positioning operations are designed to overlap and continue throughout the bonding process. While one die is being measured and aligned, other dies can be prepared or positioned, maintaining continuous productive action rather than sequential idle periods.
Data Source
Figure 1A~1C
Figure 1D
Figure 2A~2B
AI summary
An apparatus and method of operating said apparatus, the apparatus comprising at least a first stage configured to support one or more donor dies and a second stage configured to support one or more target dies, the apparatus configured to measure a position of the one or more donor dies and configured to measure a position of the one or more target dies and to provide relative movement between at least one of the one or more donor dies and a corresponding one of the one or more target dies for die bonding by movement of the first stage and/or the second stage.