Multistage Micromechanical Timepiece Stacked Semiconductor Subassemblies
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Solution Overview
Problem
Current clockmaking components based on semiconductor materials are limited to single-level structures, preventing the creation of robust and compact timepieces with multiple functional subassemblies secured along axes, and existing assembly techniques result in lower quality components due to inaccurate alignment and poor interface quality.
Innovation Solution
A multi-level micromechanical timepiece is created using semiconductor material subassemblies secured together by bridges, with deformable links allowing for movement between portions, forming a monolithic piece, and a manufacturing method involving sacrificial layers and deep etching processes to achieve precise alignment and integration of movable elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If single-level semiconductor components are used, then manufacturing simplicity is maintained, but functional complexity and compactness are limited
Solution Approach 1:
The patent transitions from single-level planar structures to multi-level three-dimensional structures by stacking functional subassemblies vertically. This dimensional change allows multiple functional elements to be integrated in the thickness direction while maintaining manufacturability through standardized stacking processes, thereby increasing functional complexity without proportionally increasing manufacturing difficulty
Solution Approach 2:
The patent implements nested structures where functional subassemblies are stacked and secured together along the thickness direction, with each subassembly containing movable elements nested within the overall structure. This nesting approach allows multiple functional components to be integrated compactly while maintaining access to each subassembly's functionality
2Manufacturing precision
If assembly techniques are used to join subassemblies, then multi-level structures are achieved, but alignment accuracy and interface quality deteriorate
Solution Approach 1:
The patent merges multiple subassemblies into a single integrated structure by securing them together along the thickness direction. This merging approach eliminates the need for separate assembly operations, ensuring precise alignment and high-quality interfaces through monolithic construction rather than joining discrete components
Solution Approach 2:
The patent performs preliminary structuring of each subassembly before final integration, including forming movable elements and securing structures in advance. This preliminary action ensures that each subassembly is properly prepared with accurate geometries before being combined, thereby maintaining high alignment accuracy and interface quality in the final multi-level structure
3Adaptability or versatility
If movable elements are integrated within subassemblies, then functionality is improved, but structural complexity increases
Solution Approach 1:
The patent segments the timepiece into multiple functional subassemblies, each containing specific movable elements. This segmentation allows each subassembly to be independently structured with its own movable components, thereby distributing structural complexity across modular units while maintaining overall functionality and enabling precise control of each segment's behavior
Data Source
AI summary
A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.