Multistage Substrate Cooling Nozzle Layout for Uniform Gas Cooling

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Solution Overview

Problem

Existing substrate cooling processes in semiconductor manufacturing are inefficient, particularly in load lock chambers where substrates are in standby, leading to suboptimal cooling efficiency.

Innovation Solution

A substrate processing apparatus with a vessel containing multistage-supported substrates and cooling nozzles with alternating gas supply holes for efficient cooling gas distribution, allowing simultaneous cooling of both surfaces of substrates in a multistage arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single cooling nozzle is used to cool multiple substrates, then the device complexity is reduced, but the cooling efficiency and uniformity deteriorate

Engineering Contradiction:

Improvenumber of cooling nozzlesVSAvoidcooling efficiency

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The cooling system is segmented into multiple independent cooling nozzles (first cooling nozzle and second cooling nozzle), each responsible for cooling specific substrates. This segmentation allows each nozzle to be optimized for its specific cooling task, improving overall cooling efficiency and uniformity while maintaining manageable system complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each cooling nozzle is equipped with gas supply holes positioned at specific locations to cool specific substrates locally. The first cooling nozzle cools the first substrate with gas supply holes positioned to cool its surfaces, while the second cooling nozzle cools the second substrate with its own gas supply holes. This local quality approach ensures uniform and efficient cooling across all substrates.

Inventive Principle:

Principle #3Local quality

2Device complexity

If cooling gas is supplied to multiple substrates through a single nozzle, then the device complexity is reduced, but the cooling uniformity and precision deteriorate

Engineering Contradiction:

Improvecooling system structureVSAvoidcooling uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The cooling gas supply system is segmented into multiple nozzles, each with its own gas supply holes positioned to cool specific substrates. This segmentation enables precise control of cooling gas distribution, ensuring uniform cooling across all substrates while maintaining a relatively simple overall system structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple cooling nozzles act as intermediaries between the cooling gas source and the substrates. Each nozzle is positioned and configured to deliver cooling gas to specific substrates, ensuring uniform and precise cooling. This intermediary approach improves cooling uniformity while keeping the system structure manageable.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If substrates are cooled in a multistage arrangement, then the cooling efficiency is improved, but the device complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidsubstrate support structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The substrates are arranged in a multistage configuration along the vertical dimension, with multiple substrates positioned at different heights within the vessel. This vertical arrangement allows multiple cooling nozzles to cool multiple substrates simultaneously, significantly improving cooling efficiency. The support structure is designed to hold substrates in this vertical arrangement, managing the added complexity through efficient spatial utilization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency by uniformly cooling substrates in a shorter time with reduced gas consumption, minimizing thermal impact on subsequent handling processes.

Implementation Method 1

a first cooling nozzle and a second cooling nozzle among the plurality of cooling nozzles are configured such that the cooling gas is supplied for a first substrate among the plurality of substrates through the gas supply hole of the first cooling nozzle, and the cooling gas is supplied for a second substrate other than the first substrate among the plurality of substrates through the gas supply hole of the second cooling nozzle

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260002742A1Cooling System, Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium

Publication Date: 2026.01.01 KOKUSAI DENKI KK

AI summary

To improve the cooling efficiency of a substrate, a cooling system includes: a vessel with a support capable of supporting a plurality of substrates in a multistage manner; and a plurality of cooling nozzles arranged along an inner surface of the vessel, wherein each of the plurality of cooling nozzles includes a gas supply hole through which a cooling gas is supplied for the plurality of substrates supported by the support, wherein a first cooling nozzle and a second cooling nozzle among the plurality of cooling nozzles are configured such that the cooling gas is supplied for a first substrate among the plurality of substrates through the gas supply hole of the first cooling nozzle, and the cooling gas is supplied for a second substrate other than the first substrate among the plurality of substrates through the gas supply hole of the second cooling nozzle.