Multistage Vapor Deposition Source with Vacuum Exhaust
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Solution Overview
Problem
The existing vapor deposition devices suffer from low material usage efficiency due to high scattering of vapor deposition particles, leading to broad film thickness distribution and reduced efficiency in scan vapor deposition techniques, particularly in large substrate film formation.
Innovation Solution
A vapor deposition source with multistage nozzle portions and a vacuum exhaust unit connected to spaces between the nozzles, adjusting pressure to ensure vapor deposition particles are emitted with higher directivity, reducing scattering and improving material usage efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a single-stage vapor deposition nozzle is used, then the device structure is simple, but the vapor deposition particles scatter in various directions resulting in low material usage efficiency
Solution Approach 1:
The vapor deposition source is divided into multiple stages (first stage, second stage, third stage nozzles) with different functions. The first stage nozzle emits particles, the second stage nozzle regulates flow direction, and the third stage nozzle provides final emission control. This segmentation allows each stage to optimize particle directionality, reducing scattering and improving material usage efficiency while maintaining manageable structural complexity through modular design
Solution Approach 2:
The patent introduces a vertical stacking dimension by arranging multiple nozzle stages in the depth direction (Z-axis) rather than using a single planar nozzle structure. This three-dimensional configuration enables particles to be emitted and regulated through multiple spatial layers, improving directivity control and reducing lateral scattering without significantly increasing the device's footprint area
2Loss of substance
If regulation plates are used to control vapor deposition flow, then material usage efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The patent merges the functions of multiple nozzles and their associated regulation mechanisms into an integrated multi-stage vapor deposition source. The first, second, and third stage nozzles work together as a unified system, with each nozzle incorporating its own regulation capability. This merging approach improves material usage efficiency through coordinated particle flow control while avoiding the complexity of separate, independently operated regulation devices
Solution Approach 2:
Each nozzle stage in the multi-stage configuration serves multiple functions: the first stage nozzle performs both particle emission and initial flow direction control, the second stage nozzle provides both flow regulation and particle acceleration, and the third stage nozzle delivers final emission control and directivity adjustment. This multi-functionality reduces the need for separate specialized components, improving material usage efficiency without proportionally increasing device complexity
3Loss of substance
If vapor deposition particles are emitted with high directivity, then material usage efficiency improves, but pressure control becomes more difficult
Solution Approach 1:
The patent applies different pressure conditions to different spatial regions within the vapor deposition source. The first stage nozzle operates under higher pressure to generate particle flow, the intermediate region maintains a pressure gradient for flow regulation, and the emission region operates under lower pressure for direct particle emission. This local quality differentiation enables high directivity particle emission while managing pressure control through zoned regions rather than uniform pressure management
Solution Approach 2:
The multi-stage nozzle system dynamically adjusts particle flow characteristics at each stage. The first stage nozzle dynamically emits particles based on heating rate, the second stage nozzle dynamically regulates flow direction in response to particle momentum, and the third stage nozzle dynamically controls final emission angles. This dynamic adaptation allows the system to maintain high directivity under varying pressure conditions without requiring complex active pressure control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances material usage efficiency by reducing particle scattering, achieving a sharper film thickness distribution and improving the accuracy of vapor deposition film formation on large substrates.
Implementation Method 1
a pressure difference is generated in the space part by use of the vacuum exhaust unit, thereby a flow of the vapor deposition particles is regulated
Implementation Method 2
the vapor deposition material heated by the heating portion to be evaporated or sublimated is externally emitted
Implementation Method 3
the vapor deposition material heated by the heating portion to be evaporated or sublimated is externally emitted
Implementation Method 4
the vapor deposition material heated by the heating portion to be evaporated or sublimated is externally emitted to outside from an emitting port as the vapor deposition particles and deposited on the target film forming substrate
Data Source
AI summary
To provide a vapor deposition source of which material usage efficiency is higher as compared with the related art. A vapor deposition source (10) includes a vapor deposition particles ejecting unit (30) configured to include multistage of nozzle units layered apart from each other in a vertical direction, each of the nozzle units including at least one vapor deposition nozzle (32, 52), and at least one space part (43) provided between the multistage of vapor deposition nozzles, and a vacuum exhaust unit (14) connected with the at least one space part (43).