Multi-Step Interposer Layout for Space-Efficient PCB Stacking
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Solution Overview
Problem
The challenge in electronic devices is the limited inner space due to thickness reduction, leading to difficulties in arranging substrates with varying electronic component heights, resulting in wasted space and vulnerability to warpage of substrates under stress.
Innovation Solution
An electronic device with an interposer formed in a multi-step or partition structure is introduced, which electrically connects substrates and divides the inner space into regions, allowing for efficient use of vertical space and preventing substrate warpage by supporting electronic components with varying heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrates are arranged to accommodate electronic components of varying heights, then space utilization improves, but substrate warpage vulnerability increases due to stress concentration in unsupported regions
Solution Approach 1:
The interposer is divided into multiple regions with different heights (multi-step structure), where each step corresponds to a specific mounting region for electronic components. This segmentation allows the interposer to provide targeted support at different locations, accommodating components of varying heights while maintaining substrate stability and preventing warpage in unsupported areas.
2Ease of manufacture
If a single-height interposer is used, then manufacturing simplicity is maintained, but space efficiency deteriorates due to inability to accommodate varying component heights
Solution Approach 1:
The interposer is segmented into multiple steps or regions with different heights, allowing each region to be optimized for specific mounting requirements. This segmentation enables efficient use of vertical space by accommodating electronic components of varying heights without requiring a completely complex manufacturing process, as the multi-step structure can be integrated into standard PCB fabrication techniques.
Data Source
AI summary
An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.