Multi-Substrate Semiconductor Package for Thin Electrical Isolation
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving optimal electrical isolation and package thickness, particularly due to the presence of spacers and lead configurations that limit thinness and increase complexity.
Innovation Solution
The semiconductor package design incorporates a first and second substrate with leads physically and electrically coupled, where the second group of leads is electrically isolated from the first substrate using copper islands, allowing for thinner package designs and improved electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional lead configurations with spacers are used, then electrical isolation is achieved, but package thickness increases and complexity increases
Solution Approach 1:
The patent extracts and eliminates the spacer component from the traditional lead configuration. By removing the spacer, the package thickness is reduced while the electrical isolation function is maintained through alternative means (lead configuration and substrate design).
Solution Approach 2:
The leads serve multiple functions: they provide electrical connectivity and simultaneously provide electrical isolation without requiring separate spacer components. The lead configuration itself is designed to achieve both mechanical support and electrical isolation functions.
2Reliability
If traditional lead configurations with spacers are used, then electrical isolation is achieved, but device complexity increases
Solution Approach 1:
The spacer component is extracted and removed from the package structure. This elimination simplifies the overall device complexity by reducing the number of discrete components while maintaining the essential electrical isolation function through integrated lead and substrate design.
Solution Approach 2:
The electrical isolation function is merged into the lead configuration and substrate design itself, rather than being provided by a separate spacer component. This integration reduces the number of parts and simplifies the overall package structure.
3Reliability
If copper islands are used for electrical isolation, then electrical isolation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses standard PCB fabrication techniques to create copper islands, which are essentially copied from well-established manufacturing processes. This approach leverages existing, highly refined manufacturing capabilities rather than requiring new precision techniques.
Solution Approach 2:
The copper islands are designed with specific dimensional parameters and spacing that optimize electrical isolation while remaining compatible with standard manufacturing tolerances. By carefully selecting these parameters, the design achieves high reliability without exceeding standard manufacturing precision capabilities.
Data Source
AI summary
Implementations of a semiconductor package may include a first substrate including a first group of leads physically coupled thereto and a second group of leads physically coupled thereto; a second substrate coupled over the first substrate and physically coupled to the first group of leads and the second group of leads; and one or more semiconductor die coupled between the first substrate and the second substrate. The second group of leads may be electrically isolated from the first substrate.