Multisurfaced Microdevice System Array Fabrication
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Solution Overview
Problem
Current microdevice systems are complex, expensive, and lack a universal, complete, and versatile 'system-on-a-chip' for diverse applications, with most devices fabricated on flat, two-dimensional substrates, limiting their versatility and integration, especially in large-scale applications.
Innovation Solution
A multisurfaced microdevice system array is developed, featuring multiple substrates with microdevices on both surfaces, forming a multifaced configuration that allows for cooperative functioning, energy transfer, and data communication, using techniques like convergent assembly and biomimetics to create extendable arrays for sensing, actuating, and controlling functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If microdevices are fabricated on flat, two-dimensional substrates, then manufacturing processes are simple and cost-effective, but device versatility and integration are limited
Solution Approach 1:
The patent transitions from two-dimensional substrate fabrication to three-dimensional multisurfaced structures. Multiple substrates are stacked and bonded together with microdevices fabricated on different surfaces at different heights, enabling vertical integration and enhanced device versatility while maintaining compatibility with existing planar fabrication processes
2Adaptability or versatility
If microdevices are fabricated on both surfaces of wafers, then device integration and versatility improve, but production line retooling costs and time increase
Solution Approach 1:
The patent divides the fabrication process into separate stages: first fabricating microdevices on one surface, then bonding substrates together, and finally fabricating additional microdevices on opposite surfaces. This segmentation allows existing production lines to continue operating without major retooling while achieving enhanced device integration
3Ease of operation
If microdevices on one surface are fabricated before the other surface, then production flexibility improves, but risk of damaging existing microdevices during subsequent fabrication increases
Solution Approach 1:
The patent applies protective coatings to microdevices on the first surface before fabricating microdevices on the opposite surface. This protective layer acts as a cushion against potential damage during subsequent fabrication processes, allowing production flexibility while maintaining microdevice reliability
4Productivity
If substrates are stacked to form multisurfaced structures, then device density and functionality increase, but precision alignment and registration between surfaces become more difficult
Solution Approach 1:
The patent incorporates registration features and alignment marks on substrate surfaces before bonding. These preliminary alignment mechanisms ensure precise positioning of microdevices on opposite surfaces, enabling high device density while maintaining manufacturing precision through automated alignment processes
Data Source
AI summary
A multisurfaced microdevice system array is produced from a wafer formed of semiconductor substrate material. Sensing, controlling and actuating microdevices are fabricated at specific location on both sides of the wafer, and the wafer is diced. Each die thus created is then formed into a multisurfaced, multifaced structure having outer and inner faces. The multifaced structure and the microdevices form a standardized microdevice system, and cooperatively combined microdevice systems form a microdevice system array. Communication of energy and data to and between microdevices on each and other microdevice systems of the microdevice system array is provided by energy transferring devices including electric conductors for transferring electric energy, ultrasound emitters and receivers for transferring acoustic energy, and electromagnetic energy emitters and receivers for transferring electromagnetic energy.