Multi-TIM IC Packages Mitigating Warpage Delamination
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Solution Overview
Problem
Integrated circuit packages experience warpage due to material differences, leading to delamination issues between thermal interface materials and package components, particularly at corners and weakly adhered surfaces, which worsens with package size increases.
Innovation Solution
The use of multiple discrete thermal interface materials with different compositions and grooves, rather than a single large TIM, is employed to reduce stress and delamination by distributing stress evenly across the package components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large thermal interface material is used to cover the entire package, then heat dissipation coverage is improved, but stress concentration and delamination occur at corners and weakly adhered surfaces
Solution Approach 1:
The patent divides a single large thermal interface material into multiple smaller discrete TIMs, each covering specific package components. This segmentation reduces stress concentration at corners and interfaces, preventing delamination while maintaining adequate heat dissipation coverage across the package substrate.
2Adaptability or versatility
If package size is increased to improve integration level, then functionality is enhanced, but warpage becomes more severe
Solution Approach 1:
The patent applies segmentation by using multiple smaller TIMs instead of one large TIM, which reduces the overall stress on the package structure. This helps mitigate warpage issues that arise from material differences in larger, more integrated packages while still providing comprehensive thermal management.
3Stability of the object's composition
If multiple discrete thermal interface materials with different compositions are used, then stress distribution is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by using different TIM compositions for different package components based on their specific thermal and mechanical requirements. Each TIM is selected to match the local characteristics of the underlying component, optimizing stress distribution and thermal conductivity at each location while maintaining overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces delamination and improves thermal interface material coverage, achieving higher adherence and heat dissipation efficiency across the package components.
Implementation Method 1
thermal interface material may be used to conduct heat from the device dies in the integrated circuit packages to heat sinks
Data Source
AI summary
A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.