Multivariate Analysis for Targeted IC Metrology
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Solution Overview
Problem
Current production control methods for integrated circuits rely on sampling a small portion, which may miss defects or marginal instances, leading to potential failures, and are costly and time-consuming, making it commercially infeasible to compile parameter data across entire ICs.
Innovation Solution
Implementing a multivariate analysis of design marginalities to identify critical sites and features for targeted inspections, generating a Design Fabrication Kit that guides the fabrication process, reducing the number of necessary tests while increasing the probability of detecting defects or marginal instances, compatible with existing IC design and manufacturing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If parameter data is collected from a small representative portion of the IC, then testing time and cost are reduced, but the probability of missing defects or marginal instances increases
Solution Approach 1:
The system performs preliminary analysis during the design phase to identify critical sites and features that are likely to contain defects or marginal instances. This advance preparation creates a targeted inspection list that guides production control, allowing focused testing without requiring comprehensive sampling of the entire IC.
Solution Approach 2:
Instead of uniform sampling across the entire IC, the system applies different inspection strategies to different locations based on their criticality. Critical sites identified through design analysis receive targeted inspection, while non-critical areas require less testing, optimizing the balance between detection accuracy and testing efficiency.
2Reliability
If parameter data is collected from more locations of the IC, then defect detection accuracy improves, but testing cost and time increase
Solution Approach 1:
The system performs preliminary analysis during the design phase to identify critical sites and features that are likely to contain defects or marginal instances. This advance preparation creates a targeted inspection list that guides production control, allowing focused testing without requiring comprehensive sampling of the entire IC.
Solution Approach 2:
The system performs more analysis during the design phase (excessive action in analysis) to identify critical areas, which then enables fewer physical inspections during production (partial action in testing). This shifts effort from comprehensive physical sampling to targeted inspection based on design-derived insights.
3Reliability
If comprehensive parameter data collection is performed across the entire IC, then all defects can be detected, but the process becomes prohibitively expensive and time-consuming
Solution Approach 1:
The system performs preliminary analysis during the design phase to identify critical sites and features that are likely to contain defects or marginal instances. This advance preparation creates a targeted inspection list that guides production control, allowing focused testing without requiring comprehensive sampling of the entire IC.
Solution Approach 2:
The system changes the parameters of inspection by using design-derived information to transform the inspection strategy from uniform comprehensive sampling to targeted sampling based on criticality. This parameter change enables feasible production control that balances detection completeness with manufacturing efficiency.
Data Source
AI summary
Targeted production control using multivariate analysis of design marginalities. A list of a plurality of metrology operations is accessed during production of an integrated circuit device. The list is generated from operations performed in the design of the integrated circuit device. At least one of the plurality of metrology operations is performed on the integrated circuit device. A manufacturing process of the integrated circuit device may be adjusted responsive to results of the performing.


