Multiwavelength Optical Sub-Assembly Module Segmentation
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Solution Overview
Problem
Conventional multiwavelength optical sub-assembly modules face challenges in optical arrangement complexity, product defects due to overheating, and inability to replace individual defective components, leading to scrapped products and unreliable screening processes.
Innovation Solution
A multiwavelength optical sub-assembly module design featuring separate transceiver units installed on individual substrates, with optical filter units and lens systems that guide and arrange optical signals, allowing for easy replacement of defective parts and improved reliability, while preventing overheating through reduced part density and using a screening filter to prevent signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips are installed on one substrate in a conventional multiwavelength sub-assembly module, then the optical arrangement is difficult and takes long time, but the device complexity is reduced
Solution Approach 1:
The patent divides the conventional single-substrate multi-chip module into multiple independent sub-assemblies, each containing one chip mounted on its own substrate. This segmentation allows each sub-assembly to be optically arranged independently and quickly, then assembled into the final module, thereby significantly improving optical arrangement speed while maintaining manageable device complexity through modular design.
2Temperature
If multiple chips are mounted on one substrate, then there is a problem in that a product defect occurs due to overheating, but the manufacturing process is simplified
Solution Approach 1:
By separating multiple chips onto different substrates in individual sub-assemblies, each chip has its own thermal management space, preventing heat accumulation that would occur if multiple chips were mounted on a single substrate. This segmentation improves heat dissipation while the standardized sub-assembly design maintains ease of manufacture through modular production and assembly processes.
3Reliability
If a defect occurs in one of the plurality of chips in the conventional multiwavelength sub-assembly module, then there is a problem in that the entire product has to be scrapped, but the device complexity is reduced
Solution Approach 1:
The patent structures the module as multiple independent sub-assemblies, each with its own chip and substrate. If one chip fails, only the corresponding sub-assembly is affected and can be replaced individually, while other sub-assemblies continue to function. This segmentation provides defect tolerance and improves reliability without requiring overly complex redundancy systems.
4Reliability
If evaluation of an individual optical device is impossible in the conventional module, then there is a problem in that a process of screening samples having poor reliability cannot be performed, but the device complexity is reduced
Solution Approach 1:
By isolating each optical device in its own sub-assembly with individual substrate and mounting structure, the patent enables independent testing and evaluation of each device before final module assembly. This segmentation allows for reliable device screening to identify poor-quality components without requiring complex in-situ evaluation systems, thereby improving overall product reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient transmission of multiple optical signals through a single cable, allows for reliable evaluation and replacement of defective components, suppresses signal distortion, and improves productivity by enabling mass production of transceiver units.
Implementation Method 1
an optical reflection unit for transmission disposed to face the lens light guide unit for transmission and configured to reflect an optical signal and guide the optical signal to the lens light guide unit for transmission
Implementation Method 2
a lens light guide unit for transmission disposed on a straight line with the lens unit and configured to pass an optical signal having a set wavelength or more
Data Source
AI summary
A multiwavelength optical sub-assembly module including a housing to be connected to an optical cable, a plurality of optical filter units coupled to the housing and configured to guide optical signals, a plurality of transceiver units coupled to the housing and configured to receive the optical signals through the optical filter units or transmit the optical signals to the optical filter units, and a substrate coupled to each of the transceiver units. Thus, distortion of an optical signal is suppressed, and the defect rate of a product is allowed to be decreased by evaluating reliability.