Multi-Wavelength Photonic Sensing Module Without Wavelength Scanning

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Solution Overview

Problem

Wearable devices require compact, non-invasive, and cost-effective optical sensing modules capable of measuring biological parameters with high specificity and sensitivity, while existing technologies often suffer from complexity and high costs associated with wavelength scanning.

Innovation Solution

A silicon or silicon nitride photonic integrated circuit (PIC) with multiple lasers operating at different wavelengths, integrated optical components, and photodetectors, enabling diffuse reflectance spectrophotometry and Raman spectroscopy for biological tissue analysis, allowing for compact, versatile, and efficient sensing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional wavelength scanning methods are used, then measurement versatility is improved, but device complexity and cost increase

Engineering Contradiction:
Improvemeasurement versatilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The system segments the wavelength range into multiple discrete bands, with each laser diode responsible for a specific wavelength range. This allows the system to achieve versatile spectral coverage through multiple simple, fixed-wavelength sources rather than one complex scanning mechanism, thereby reducing overall device complexity while maintaining measurement versatility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The photonic integrated circuit serves multiple functions: it integrates multiple laser diodes, optical waveguides, modulators, and detectors into a single platform that can perform various spectroscopic measurements across different wavelength ranges. This multi-functional integration eliminates the need for separate scanning devices for each wavelength range, reducing complexity while preserving versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple wavelength sources are integrated, then measurement capability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvemeasurement capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Multiple laser diodes operating at different wavelengths are integrated onto a single photonic integrated circuit substrate. The circuit combines wavelength-division multiplexing components, optical modulators, and detectors into one unified structure, enabling multi-wavelength measurements while simplifying manufacturing compared to assembling separate devices.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces mechanical wavelength scanning systems with a photonic integrated circuit that uses optical waveguides and modulators to electronically control and switch between multiple fixed wavelength sources. This substitution eliminates complex mechanical moving parts, reducing manufacturing complexity while enhancing measurement capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If compact sensing module is designed, then wearability is improved, but optical component integration becomes more difficult

Engineering Contradiction:
Improvesensing module sizeVSAvoidoptical component integration
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The photonic integrated circuit employs a nested structure where optical waveguides are embedded within the substrate, modulators are integrated along the waveguide paths, and detectors are positioned to receive light through the same compact structure. This nesting allows multiple optical components to be packed into a minimal volume, achieving wearability while managing integration complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent utilizes three-dimensional integration within the photonic circuit, stacking optical components in vertical layers and using waveguide routing that exploits the depth dimension. This approach packs more optical functionality into a smaller footprint, improving wearability while the systematic layering manages the complexity of component integration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a compact platform for wearable devices that can measure various biophysical and biochemical biomarkers with high sensitivity and selectivity, reducing the need for complex detectors and enabling multiple applications in healthcare and robotics.

Implementation Method 1

a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength of the others

Methodology Applied
Scientific EffectLight emission: Light

Implementation Method 2

the light penetrates the surface and is scattered so that a proportion of the light returns to the sensor module. Along its path through the biological tissue the light may be absorbed by analytes

Methodology Applied
Scientific EffectDiffuse reflectance: Scattering

Implementation Method 3

an optical modulator

Methodology Applied
Scientific EffectOptical modulation: Phase Modulation

Implementation Method 4

one or more photodetectors integrated into the transmitter PIC or located separately

Methodology Applied
Scientific EffectLight detection: Photoelectric Effect

Data Source

PatentUS12490934B2Optical sensing module
Publication Date: 2025.12.09 CHAMARTIN LABORATORIES LLC
  • US12490934B2 patent drawing
  • US12490934B2 patent drawing
  • US12490934B2 patent drawing

AI summary

An optical sensing module suitable for wearable devices, the optical sensing module comprising: a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising: a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength of the others; an optical manipulation region, the optical manipulation region comprising one or more of: an optical modulator, optical multiplexer (MUX); and additional optical manipulation elements; and one or more optical outputs for light originating from the plurality of lasers.